|
[China]
Trade Verify
Address: Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China
Contact name:Rosy Shao
INFINITE AUTOMATION CO ., LIMITED |
|
Verified Suppliers
|
|
|
Infinite Automation Co., Ltd. is a trusted name in supplying the best reconditioned second-hand SMT machines and factory automation solution products. Our company is focusing on the supply of pre-owned Solder Paste Printers, SMT Chip Mounters, Automatic Optical Inspection, and other PCB assembly line solution products. Among our offered pre-owned and reconditioned Solder Paste Printing Machine is the MPM Edison Stencil Printer. The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Device manufacturing markets. The Edison printer is the industries’ most accurate printer with +/- 15μ @ 6σ wet print repeatability. Total throughput is lightning fast due in part to the highly efficient, parallel processing of the stencil shuttle system, stencil wiping, paste dispensing, and vision alignment system.
MPM EDISON STENCIL PRINTER
FEATURES:
| Substrate processing: |
| Maximum substrate size (XxY): 450mmx350mm (17.72"x13.78") |
| For boards larger than 14", special fixtures are required |
| Minimum substrate size (XxY): 50mm x 50mm (1.97" x 1.97") |
| Substrate thickness dimensions: FoilClamps: 0.2mm to 6.0mm (0.007" to 0.236") |
| EdgeLoc (edge ??clamping system): 0.8mm to 6.0mm (0.031" to 0.236") |
| Maximum substrate weight: 4.5kg (10lbs) |
| Substrate edge gap: 3.0mm (0.118") |
| Bottom clearance: 12.7mm (0.5") standard. Configurable 25.4mm (1.0") |
| Substrate clamping: fixed top clamping, table vacuum option: EdgeLoc edge clamping system |
| Substrate support method: magnetic thimble and support block |
| Printing parameters: |
| Maximum printing area (XxY): 450mmx350mm (17.71"x13.78") |
| Snap-off: 0mm to 6.35mm (0" to 0.25") |
| Printing speed: 305mm / sec (12.0" / sec) |
| Printing pressure: 0 to 20kg (0lb to 44lbs) |
| Template frame size: 737mmx737mm (29"x29") smaller size template optional |
| Image field of view (FOV): 9.0mm x 6.0mm (0.354" x 0.236") |
| Reference point type: standard shape reference point (see SMEMA standard), pad/opening |
| Camera System: Single Digital Camera - Patented Separated Optical Vision |
| Alignment accuracy and repeatability of the entire system: ±8 μm (±0.0003”)@6σ, Cpk≥2.0* |
| Technical indicators are represented by process changes in the production environment. This performance data includes printing speed, table rise, and camera movement. |
| Actual solder paste placement accuracy and repeatability: ±15 μm (±0.0006”)@6σ, Cpk≥2.0* |
| Actual solder paste print position repeatability based on third-party test system verification |
| Cycle time: 30015 seconds including printing and wiping, and 20020 seconds including printing and wiping |
| Power requirements: 200 to 240VAC (±10%) single-phase @50/60Hz, 15A |
| Compressed air requirements: 100psi@4cfm (standard operating mode) to 18cfm (vacuum wipe) (6.89bar@1.9L/s to 8.5L/s), 12.7mm (0.5") diameter tube |
| Machine height: (removing the lighthouse) 1580mm (62.2") at 940mm (37.0") transport height |
| Machine depth: 1442mm (56.77") |
| Machine width: 1282mm (50.47") |
| Minimum gap in front: 508mm (20.0") |
| Minimum clearance behind 508mm (20.0") |
| The higher the Cpk value, the lower the variability of the process specification limits. In a qualified 6 sigma process (ie, allowing 6 standard deviations to be added or subtracted within the specification limits), Cpk ≥ 2.0. Speedline reserves the right to make changes to the technical specifications without prior notice. Please consult the factory for specific specifications. |
IMAGES:
