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6l Enig Pcb Smt Assembly Military Industrial Sphere

Beijing Haina Lean Technology Co., Ltd
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Address: Room 704-3, 7 / F, Building 9, Yard 8, Development Road, Changping District, Beijing

Contact name:Marina

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Beijing Haina Lean Technology Co., Ltd

6l Enig Pcb Smt Assembly Military Industrial Sphere

Country/Region china
City & Province beijing beijing
Categories Electronics Production Machinery
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Product Details

6L ENIG Military-industrial sphere PCB Assembly

 

Haina Lean is an entity enterprise that specializes in electronic product design and development, supply chain management, PCBA and one-stop (OEM) production services for complete machine products. Also it owns profuse experience in manufacturing PCB,owned experienced technical R & D technology team, young and professional sales and customer service team, experienced and professional procurement team and assembly testing team, which make sure the products quality of the pass rate, on-time delivery rate of customer orders. Welcome to visit our factory!

 

Our Service

PCB project

PCB design

PCB manufacture 

PCB Solutions

PCB Assembly

Box Assembly

 

PCB CAPABILITIES

 
FACTORY CAPABILITIES
No.Items20192020
1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
2Max layer count32L36L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole SizeLaser 0.075mmLaser 0.05mm
Mechnical 0.15mmMechnical 0.15mm
5Min Line Width/Space0.035mm/0.035mm0.030mm/0.030mm
6Copper Thickness1/3oz-4oz1/3oz-6oz
7Size Max Panel size700x610mm700x610mm
8Registration Accuracy+/-0.05mm+/-0.05mm
9Routing Accuracy+/-0.075mm+/-0.05mm
10Min.BGA PAD0.15mm0.125mm
11Max Aspect Ratio10:110:1
12Bow and Twist0.50%0.50%
13Impedance Control Tolerance+/-8%+/-5%
14Daily Output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
 
PCBA CAPABILITIES

 

PCBA Capability
Material TypeItemMinMax
PCBDimension (length,width,height.mm)50*40*0.38600*400*4.2
MaterialFR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finishHASL,OSP,Immersion gold,Flash Gold Finger
ComponentsChip&IC100555mm
BGA Pitch0.3mm-
QFP Pitch0.3mm-

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology. These solutions include:

7 high-speed placement machines,

7 automatic printers with fiducial alignment,

2 X-ray machines,

BGA maintenance machines,

ICT test machines

 

PCB SMT Assembly Process

 

1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test

 

Our advantage

 

1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

 

PCB SMT Assembly Delivery Time 

 

Product TypeQtyNormal lead timeQuick-turn lead time
SMT+DIP1-501WD-2WD8H
SMT+DIP51-2002WD-3WD1.5WD
SMT+DIP201-20003WD-4WD2WD
SMT+DIP≥20014WD-5WD3WD
PCBA(2-4Layer)1-502.5WD-3.5WD1WD
PCBA(2-4Layer)51-20005WD-6WD2.5WD
PCBA(2-4Layer)≥2001≥7WD5WD
PCBA(6-10Layer)1-503WD-4WD2.5WD
PCBA(6-10Layer)51-20007WD-8WD6WD
PCBA(10-HDILayer)1-507WD-9WD5WD
PCBA(10-HDILayer)51-20009WD-11WD7WD

 

Electronic Board Assembly Application Field 

 

Our products are widely used in Military-Industrial sphere ,Automotive /automobile , Medical .Communication Solution, Industrial Control, Aerospace , image processing ,video processing technology ,smart home ,securit etc.

 

 

Workshop

 

 

 

Common packaging

 

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box

 

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