Active Member
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[China]
Address: Room 704-3, 7 / F, Building 9, Yard 8, Development Road, Changping District, Beijing
Contact name:Marina
Beijing Haina Lean Technology Co., Ltd |
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HDI PCB Board Manufacturing also known as high-density interconnect PCB, is a kind of PCB with a higher wiring density per unit area than traditional boards. HDI boards are more compact and have smaller vias, pads, copper traces and spaces. As a result, HDIs have denser wiring resulting in lighter weight, more compact, lower layer count PCBs. HDI PCB is more fit into the little spaces and have a smaller amount of mass than conservative PCB designs.
| Item | Capabilities |
| Number of Layers | 1 - 36layers |
| Order Quantity | 1pc - 10000+pcs |
| Material | FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination |
| Board Size | 700*610mm |
| Board Thickness | 0.3mm - 3.5mm |
| Copper Weight (Finished) | 0.33oz - 6.0oz |
| Min Tracing/Spacing | 3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black, Yellow ,Etc |
| Surface Finish | HASL - Hot Air Solder Leveling |
| Lead Free HASL - RoHS | |
| ENIG - Electroless Nickle/Immersion Gold - RoHS | |
| Immersion Silver - RoHS | |
| Immersion Tin - RoHS | |
| OSP - Organic Solderability Preservatives - RoHS | |
| Min Annular Ring | 4mil, 3mil - laser drill |
| Min Drilling Hole Diameter | 6mil, 4mil - laser drill |
| HDI Capabilities | HDI ELIC (5+2+5) |
| Other Techniques | Flex-rigid combination |
| Via In Pad | |
| Buried Capacitor (only for Prototype PCB total area ≤1m²) |
1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer
pairs.
Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment
| 1.PCB design: we can provide circuit design & PCB layout support. | 5.Component procurement: we have rich experience purchasing & material control expertise team. |
| 2.SMT Assembly: Leading edge surface mount population technologies. | 6.Complete turnkey solutions |
| 3.PTH Assembly: RoHS compliant wave soldering & hand soldering capabilities. | 7.Function Test & Inspection: |
| 4.PCB Fabrication: You only need provide Gerber files or other design files . | 8.We offer test & inspection services on PCB & Assembly (X-ray,ICT, AOI and Functional tests) |
1.High Component Density
2.Space-saving
3.Lightweight Boards
4.Fast Processing
5.Save Number of Layers
6.Accommodate Low Pitch Packages
7.High Reliability
HDI PCB board are mainly used for many industries , Like : Automotive ; aerospace industries;medical devices;Industrial automation,etc .
Except mentioned above, you'll also can find high-density interconnect PCBs in all types of digital devices, like smartphones and tablets, in automobiles, aircraft , mobile /cellular phones, touch-screen devices, laptop computers, digital cameras, 4/5G network communications, and military applications such as avionics and smart munitions.
PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box
Beijing Haina lean Electronics Co.,Ltd is one of the most professional PCB manufacture in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production capability 4000 square meters.
Our factory is providing high quality bare PCB, PCB layout design service and PCB assembly service,including components sourcing, function test,conformal coating and complete assembly for clients all.
