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FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board

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Beijing Haina Lean Technology Co., Ltd

FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board

Country/Region china
City & Province beijing beijing
Categories Electronics Production Machinery
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Product Details

FR-4 High Precision Motherboard Multilayer Electronic HDI PCB Board

 

HDI PCB Board Introduction

 

HDI PCB Board means as high-density interconnect PCB, is a kind of PCB with a higher wiring density per unit area than traditional boards.

HDI boards are more compact and have smaller vias, pads, copper traces and spaces.

As a result, HDIs have denser wiring resulting in lighter weight, more compact, lower layer count PCBs.

HDI PCB is more fit into the little spaces and have a smaller amount of mass than conservative PCB designs.

Advantages of HDI PCB: High Component Density; Space-saving; Lightweight Boards; Fast Processing; Save Number of Layers; Accommodate Low Pitch Packages; High Reliability

 

Factory Capabilities

 

FACTORY CAPABILITIES
No.Items20192020
1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
2Max layer count32L36L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole Size

Laser 0.075mm

Mechnical 0.15

Laser 0.05mm

Mechnical 0.15

5Min Line Width/Space0.035mm/0.0350.030mm/0.030mm
6Copper Thickness1/3oz-4oz1/3oz-6oz
7Size Max Panel size700x610mm700x610mm
8Registration Accuracy+/-0.05mm+/-0.05mm
9Routing Accuracy+/-0.075mm+/-0.05mm
10Min.BGA PAD0.15mm0.125mm
11Max Aspect Ratio10:110:1
12Bow and Twist0.50%0.50%
13Impedance Control Tolerance+/-8%+/-5%
14Daily output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
15Surface FinishingHASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material TypeItemMinMax
PCBDimension (length,width,height.mm)50*40*0.38600*400*4.2
MaterialFR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finishHASL,OSP,Immersion gold,Flash Gold Finger
ComponentsChip&IC100555mm
BGA Pitch0.3mm-
QFP Pitch0.3mm-

 

The types of HDI PCB Board


1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.

 

 

 

Work flow for HDI

 

Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment

 

 

 

WorkShop

 

 

HDI PCB Application Field

 

Automotive and aerospace industries, where lower weight can mean more efficient operation, have been utilizing HDI PCBs at an increasing rate. such as onboard WiFi and GPS, rearview cameras and backup sensors rely on HDI PCBs. As automotive technology continues to advance, HDI tech will likely play an increasingly important role.

 

HDI PCBs are also prominently featured in medical devices; advanced electronic medical devices such as equipment for monitoring, imaging, surgical procedures, laboratory analysis etc., and incorporate HDI boards. The high-density technology promotes improved performance and smaller, more cost-effective devices, potentially improving the accuracy of monitoring and medical testing.

 

Industrial automation requires abundant computerization, and IoT devices are becoming more common in manufacturing, warehousing, and other industrial settings. Many of these advanced equipment employ HDI technology. Today, businesses use electronic tools to keep track of inventory and monitor equipment performance. Increasingly, machinery includes smart sensors that collect usage data and connect to the internet to communicate with other smart devices, as well as to relay information to management and help optimize operations.

 

Except mentioned above, you'll also can find high-density interconnect PCBs in all types of digital devices, like smartphones and tablets, in automobiles, aircraft , mobile /cellular phones, touch-screen devices, laptop computers, digital cameras, 4/5G network communications, and military applications such as avionics and smart munitions.

 

 

Delivery Time 

 

Product TypeQtyNormal lead timeQuick-turn lead time
SMT+DIP1-501WD-2WD8H
SMT+DIP51-2002WD-3WD1.5WD
SMT+DIP201-20003WD-4WD2WD
SMT+DIP≥20014WD-5WD3WD
PCBA(2-4Layer)1-502.5WD-3.5WD1WD
PCBA(2-4Layer)51-20005WD-6WD2.5WD
PCBA(2-4Layer)≥2001≥7WD5WD
PCBA(6-10Layer)1-503WD-4WD2.5WD
PCBA(6-10Layer)51-20007WD-8WD6WD
PCBA(10-HDILayer)1-507WD-9WD5WD
PCBA(10-HDILayer)51-20009WD-11WD7WD

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

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