High Frequency HDI Pcb Printed Circuit Board 8 Layer 2.4mm 2oz FR4 TG170

High Frequency HDI Pcb Printed Circuit Board 8 Layer 2.4mm 2oz FR4 TG170

HDI PCB Board Electronic PCB Board Green PCB Board PCB Manufacturing Assembly 8 Layer PCB High Frequency PCB

8L 2+N+2 HDI PCB

HDI PCB means high density interconnect printed circuit boards, they are characterized by finer lines, closer spaces, and more dense wiring.

Due to its higher circuit density than traditional circuit boards, HDI PCB designs can include smaller through holes and capture pads, as well as higher connection pad density. HDI PCB is widely used to reduce the weight and overall dimensions of products, as well as to enhance the electrical performance of the device.

HDI Board Stack-up:

1+N+1 with laser microvia and mechanical buried core via. The “1” represents “build-up” or sequential lamination on each side of the core.
i+N+i (i>=2) PCBs contain 2 or more “build-up” of high-density interconnect layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.

HSX products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing.Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.