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OEM Electronic PCB Printed Circuit Board Assembly 3OZ Copper Thickness

Shenzhen Yingsheng Technology Co., Ltd.

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[China] country

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Address: Shenzhen YingSheng Technology Co., Ltd 805, Tongxin Technology Building, Qiaotou Community, Fuhai Street, Baoan District, Shenzhen

Contact name:Zhou

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Shenzhen Yingsheng Technology Co., Ltd.

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OEM Electronic PCB Printed Circuit Board Assembly 3OZ Copper Thickness

Country/Region china
City & Province shenzhen
Categories Wiring Harness
InquireNow

Product Details

Pcb Manufacturing Pcba OEM Electronic Print Circuit Board Assembly Controller PCBA

These materials and components remain largely the same across all PCBs, with the exception of the substrate. The substrate material of a PCB changes according to the specific qualities — such as cost and bendability — each designer is looking for in their finished product.

Through Hole PCBA

Through hole parts come in radial, axial and multiple lead in many configurations. Before surface mount technology became popular in the 1980s through hole (often spelt thru-hole) was the primary method of PCB assembly for some decades. Usually mass loaded and wave soldered we hand solder through hole components when necessary.
Although generally considered the simplest form of soldering, through hole soldering is best performed by appropriately trained and skilled staff.

Wave Soldering

Our wave soldering machine is fairly standard. PCBs go into special carriers and traverse the conveyor through the flux applicator into pre-heating and finally onto the wave itself. We use non-corrosive flux where possible and the wave soldering machine usually has fairly standard 63/37 solder in it. We offer PCB cleaning, for conformal coating or similar process, but if corrosive flux is used the PCBs must be cleaned anyway.
Considerations to thermal shock, heat sinks (actual and large ground planes with direct connections), thermal sensitivity of some parts and potential contaminants are very important in the wave soldering process

Manual Soldering

Some parts or circumstances call for manual placement and soldering of parts. A part may have thermal profile requirements that preclude it from wave soldering. PCBs with double sided SMT load, where glue was not acceptible, usually have very few through hole parts but they will have to be manually placed and soldered in most cases.
Some (though not many) SMT parts cannot withstand the minimum thermal profile necessary in the reflow oven for the rest of the PCB in question.

YScircuit HDI PCB manufacturing capabilities overview
Featurecapabilities
Layer Count4-60L
Available HDI PCB Technology1+N+1
2+N+2
3+N+3
4+N+4
5+N+5
Any layer
Thickness0.3mm-6mm
Minimum line Width and Space0.05mm/0.05mm(2mil/2mil)
BGA PITCH0.35mm
Min laser Drilled Size0.075mm(3nil)
Min mechanical Drilled Size0.15mm(6mil)
Aspect Ratio for laser hole0.9:1
Aspect Ratio for through hole16:1
Surface FinishHASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill OptionThe via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
Copper filled, silver filled
Laser via copper plated shut
Registration±4mil
Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.
 
YScircuit Bare Boards Normally Delivery Time
layer/m²S<1㎡S<3㎡S<6㎡S<10㎡S<13㎡S<16㎡S<20㎡S<30㎡S<40㎡S<50㎡S<65㎡S<85㎡S<100㎡
1L4wds6wds7wds7wds9wds9wds10wds10wds10wds12wds14wds15wds16wds
2L4wds6wds9wds9wds11wds12wds13wds13wds15wds15wds15wds15wds18wds
4L6wds8wds12wds12wds14wds14wds14wds14wds15wds20wds25wds25wds28wds
6L7wds9wds13wds13wds17wds18wds20wds22wds24wds25wds26wds28wds30wds
8L9wds12wds15wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
10L10wds13wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
12L10wds15wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
14L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
16L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds
30wds
 


 




 








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