Shenzhen Yingsheng Technology Co., Ltd. |
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As a traditional PCB assembly method, thru-hole mounting process is
accomplished through collaboration of manual procedure and
automatic procedure.
• Step 1: Components Placement - This step is achieved manually by
professional engineering staff. Engineers need to quickly, yet
precisely place components on corresponding positions based on
client's PCB design files. Component placement must conform to
regulations and operation standards of thru-hole mounting process
to guarantee high quality end products. For example, they have to
clarify polarity and orientation of components, to stop operating
component from affecting ambient components, to make completed
component placement compatible with corresponding standards and to
wear anti-static wristbands when dealing with static-sensitive
components like ICs.
• Step 2: Inspection & Rectification - Once component placement
is completed, the board is then placed in a matching transport
frame where board with components plugged in will be automatically
inspected so as to determine whether components are accurately
placed. If issues concerning component placement are observed, it's
easy to get them rectified immediately as well. After all, this
takes place prior to soldering in PCBA process.
• Step 3: Wave Soldering - Now the THT components should be
accurately soldered onto circuit board. In the wave soldering
system, the board moves slowly over a wave of liquid solder at high
temperature, approximately 500°F. Afterwa
YScircuit HDI PCB manufacturing capabilities overview | |
Feature | capabilities |
Layer Count | 4-60L |
Available HDI PCB Technology | 1+N+1 |
2+N+2 | |
3+N+3 | |
4+N+4 | |
5+N+5 | |
Any layer | |
Thickness | 0.3mm-6mm |
Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) |
BGA PITCH | 0.35mm |
Min laser Drilled Size | 0.075mm(3nil) |
Min mechanical Drilled Size | 0.15mm(6mil) |
Aspect Ratio for laser hole | 0.9:1 |
Aspect Ratio for through hole | 16:1 |
Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. |
Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over |
Copper filled, silver filled | |
Laser via copper plated shut | |
Registration | ±4mil |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte
green.etc. |
layer/m² | S<1㎡ | S<3㎡ | S<6㎡ | S<10㎡ | S<13㎡ | S<16㎡ | S<20㎡ | S<30㎡ | S<40㎡ | S<50㎡ | S<65㎡ | S<85㎡ | S<100㎡ |
1L | 4wds | 6wds | 7wds | 7wds | 9wds | 9wds | 10wds | 10wds | 10wds | 12wds | 14wds | 15wds | 16wds |
2L | 4wds | 6wds | 9wds | 9wds | 11wds | 12wds | 13wds | 13wds | 15wds | 15wds | 15wds | 15wds | 18wds |
4L | 6wds | 8wds | 12wds | 12wds | 14wds | 14wds | 14wds | 14wds | 15wds | 20wds | 25wds | 25wds | 28wds |
6L | 7wds | 9wds | 13wds | 13wds | 17wds | 18wds | 20wds | 22wds | 24wds | 25wds | 26wds | 28wds | 30wds |
8L | 9wds | 12wds | 15wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
10L | 10wds | 13wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
12L | 10wds | 15wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
14L | 10wds | 16wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
16L | 10wds | 16wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |