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Custom FR4 Multi Layer Circuit Board PCBA With Immersion Gold

Shenzhen Yingsheng Technology Co., Ltd.

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[China] country

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Address: Shenzhen YingSheng Technology Co., Ltd 805, Tongxin Technology Building, Qiaotou Community, Fuhai Street, Baoan District, Shenzhen

Contact name:Zhou

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Shenzhen Yingsheng Technology Co., Ltd.

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Custom FR4 Multi Layer Circuit Board PCBA With Immersion Gold

Country/Region china
City & Province shenzhen
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Product Details

Multilayer PCB Board Manufacturer China Circuit Board Assembly PCBA custom other pcb

As a traditional PCB assembly method, thru-hole mounting process is accomplished through collaboration of manual procedure and automatic procedure.
• Step 1: Components Placement - This step is achieved manually by professional engineering staff. Engineers need to quickly, yet precisely place components on corresponding positions based on client's PCB design files. Component placement must conform to regulations and operation standards of thru-hole mounting process to guarantee high quality end products. For example, they have to clarify polarity and orientation of components, to stop operating component from affecting ambient components, to make completed component placement compatible with corresponding standards and to wear anti-static wristbands when dealing with static-sensitive components like ICs.
• Step 2: Inspection & Rectification - Once component placement is completed, the board is then placed in a matching transport frame where board with components plugged in will be automatically inspected so as to determine whether components are accurately placed. If issues concerning component placement are observed, it's easy to get them rectified immediately as well. After all, this takes place prior to soldering in PCBA process.
• Step 3: Wave Soldering - Now the THT components should be accurately soldered onto circuit board. In the wave soldering system, the board moves slowly over a wave of liquid solder at high temperature, approximately 500°F. Afterwa

YScircuit HDI PCB manufacturing capabilities overview
Featurecapabilities
Layer Count4-60L
Available HDI PCB Technology1+N+1
2+N+2
3+N+3
4+N+4
5+N+5
Any layer
Thickness0.3mm-6mm
Minimum line Width and Space0.05mm/0.05mm(2mil/2mil)
BGA PITCH0.35mm
Min laser Drilled Size0.075mm(3nil)
Min mechanical Drilled Size0.15mm(6mil)
Aspect Ratio for laser hole0.9:1
Aspect Ratio for through hole16:1
Surface FinishHASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill OptionThe via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
Copper filled, silver filled
Laser via copper plated shut
Registration±4mil
Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.
 
YScircuit Bare Boards Normally Delivery Time
layer/m²S<1㎡S<3㎡S<6㎡S<10㎡S<13㎡S<16㎡S<20㎡S<30㎡S<40㎡S<50㎡S<65㎡S<85㎡S<100㎡
1L4wds6wds7wds7wds9wds9wds10wds10wds10wds12wds14wds15wds16wds
2L4wds6wds9wds9wds11wds12wds13wds13wds15wds15wds15wds15wds18wds
4L6wds8wds12wds12wds14wds14wds14wds14wds15wds20wds25wds25wds28wds
6L7wds9wds13wds13wds17wds18wds20wds22wds24wds25wds26wds28wds30wds
8L9wds12wds15wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
10L10wds13wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
12L10wds15wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
14L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
16L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds
30wds
 


 




 








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