Shenzhen Yingsheng Technology Co., Ltd. |
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Surface mount technology allows us to compact designs and utilise
PCB space more efficiently. Power handling circuits still need
larger components but signal circuitry can seriously shrink in good
design.
Our SMT line consists of two pick and place machines, an MPM paste
printer and a panasert reflow oven with capacity to load many
thousands of parts per 8 hour shift.
Through hole parts come in radial, axial and multiple lead in many
configurations.
Before surface mount technology became popular in the 1980s through
hole (often spelt thru-hole) was the primary method of PCB assembly
for some decades.
Usually mass loaded and wave soldered we hand solder through hole
components when necessary.
Although generally considered the simplest form of soldering,
through hole soldering is best performed by appropriately trained
and skilled staff.
Our wave soldering machine is fairly standard.
PCBs go into special carriers and traverse the conveyor through the
flux applicator into pre-heating and finally onto the wave itself.
We use non-corrosive flux where possible and the wave soldering
machine usually has fairly standard 63/37 solder in it.
We offer PCB cleaning, for conformal coating or similar process,
but if corrosive flux is used the PCBs must be cleaned anyway.
Considerations to thermal shock, heat sinks (actual and large
ground planes with direct connections), thermal sensitivity of some
parts and potential contaminants are very important in the wave
soldering process
Some parts or circumstances call for manual placement and soldering
of parts.
A part may have thermal profile requirements that preclude it from
wave soldering.
PCBs with double sided SMT load, where glue was not acceptible,
usually have very few through hole parts but they will have to be
manually placed and soldered in most cases.
Some (though not many) SMT parts cannot withstand the minimum
thermal profile necessary in the reflow oven for the rest of the
PCB in question.
YScircuit HDI PCB manufacturing capabilities overview | |
Feature | capabilities |
Layer Count | 4-60L |
Available HDI PCB Technology | 1+N+1 |
2+N+2 | |
3+N+3 | |
4+N+4 | |
5+N+5 | |
Any layer | |
Thickness | 0.3mm-6mm |
Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) |
BGA PITCH | 0.35mm |
Min laser Drilled Size | 0.075mm(3nil) |
Min mechanical Drilled Size | 0.15mm(6mil) |
Aspect Ratio for laser hole | 0.9:1 |
Aspect Ratio for through hole | 16:1 |
Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. |
Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over |
Copper filled, silver filled | |
Laser via copper plated shut | |
Registration | ±4mil |
Solder Mask | Green, Red, Blue, White, Black, Purple, Matte Black, Matte
green.etc. |
layer/m² | S<1㎡ | S<3㎡ | S<6㎡ | S<10㎡ | S<13㎡ | S<16㎡ | S<20㎡ | S<30㎡ | S<40㎡ | S<50㎡ | S<65㎡ | S<85㎡ | S<100㎡ |
1L | 4wds | 6wds | 7wds | 7wds | 9wds | 9wds | 10wds | 10wds | 10wds | 12wds | 14wds | 15wds | 16wds |
2L | 4wds | 6wds | 9wds | 9wds | 11wds | 12wds | 13wds | 13wds | 15wds | 15wds | 15wds | 15wds | 18wds |
4L | 6wds | 8wds | 12wds | 12wds | 14wds | 14wds | 14wds | 14wds | 15wds | 20wds | 25wds | 25wds | 28wds |
6L | 7wds | 9wds | 13wds | 13wds | 17wds | 18wds | 20wds | 22wds | 24wds | 25wds | 26wds | 28wds | 30wds |
8L | 9wds | 12wds | 15wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
10L | 10wds | 13wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
12L | 10wds | 15wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
14L | 10wds | 16wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
16L | 10wds | 16wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |