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FR4 Material HDI PCB Board , High Precision Circuit Board For Electronic Products

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Address: Shenzhen YingSheng Technology Co., Ltd 805, Tongxin Technology Building, Qiaotou Community, Fuhai Street, Baoan District, Shenzhen

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FR4 Material HDI PCB Board , High Precision Circuit Board For Electronic Products

Country/Region	china
City & Province	shenzhen
Categories	Solar Chargers

Product Details

Shenzhen Electronic Products PCBA Board High Precision Circuit Board HDI PCB

What is HDI PCB

Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.

HDI PCBs take advantage of the most recent technologies existing to amplify the functionality of circuit boards by means of the similar or little amounts of area. This development in board technology is motivated by the tininess of parts and semiconductor packages that assist superior characteristics in innovative new products like touch screen tabs.

HDI PCB:

High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Parameters

Layers: 12
Base Material:FR4 High Tg EM827
Thickness:1.2±0.1mm
Min.Hole Size:0.15mm
Minimum Line Width/Space:0.075mm/0.075mm
Minimum Clearance between Inner Layer PTH and Line: 0.2mm
Size:101mm×55mm
Aspect Ratio:8 : 1
Surface treatment:ENIG
Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
Applications:Telecommunication

YScircuit HDI PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	4-60L
Available HDI PCB Technology	1+N+1
	2+N+2
	3+N+3
	4+N+4
	5+N+5
	Any layer
Thickness	0.3mm-6mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min laser Drilled Size	0.075mm(3nil)
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for laser hole	0.9:1
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
	Copper filled, silver filled
	Laser via copper plated shut
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

**YScircuit Bare Boards Normally Delivery Time**
layer/m²	S＜1㎡	S＜3㎡	S＜6㎡	S＜10㎡	S＜13㎡	S＜16㎡	S＜20㎡	S＜30㎡	S＜40㎡	S＜50㎡	S＜65㎡	S＜85㎡	S＜100㎡
1L	4wds	6wds	7wds	7wds	9wds	9wds	10wds	10wds	10wds	12wds	14wds	15wds	16wds
2L	4wds	6wds	9wds	9wds	11wds	12wds	13wds	13wds	15wds	15wds	15wds	15wds	18wds
4L	6wds	8wds	12wds	12wds	14wds	14wds	14wds	14wds	15wds	20wds	25wds	25wds	28wds
6L	7wds	9wds	13wds	13wds	17wds	18wds	20wds	22wds	24wds	25wds	26wds	28wds	30wds
8L	9wds	12wds	15wds	18wds	20wds	20wds	22wds	24wds	26wds	27wds	28wds	30wds	30wds
10L	10wds	13wds	17wds	18wds	20wds	20wds	22wds	24wds	26wds	27wds	28wds	30wds	30wds
12L	10wds	15wds	17wds	18wds	20wds	20wds	22wds	24wds	26wds	27wds	28wds	30wds	30wds
14L	10wds	16wds	17wds	18wds	20wds	20wds	22wds	24wds	26wds	27wds	28wds	30wds	30wds
16L	10wds	16wds	17wds	18wds	20wds	20wds	22wds	24wds	26wds	27wds	28wds	30wds	30wds

FQA

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market.

Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.

A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.