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Electronic Circuit Board Fr4 Multilayer Turnkey PCB Assembly Active Prototype IC

Chengdu Cesgate Technology Co., Ltd

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Address: 3602, Unit 1, Building 2, Phase 3, Longhu Zichen Xiangsong, Huazhaobi Xiaheng Street, Jinniu District, Chengdu, China

Contact name:Sia Li

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Electronic Circuit Board Fr4 Multilayer Turnkey PCB Assembly Active Prototype IC

Country/Region china
City & Province chengdu sichuan
Categories Electronic Signs
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Product Details

Electronic Circuit Board Fr4 Multilayer Turnkey PCB Assembly Active Prototype IC

 

 

HDI boards have the following advantages:
1. Can reduce PCB cost. When the PCB density increases beyond eight layers, it is manufactured by HDI and its cost will be lower than the traditional complex pressing process.
2. Increase circuit density, interconnection of traditional circuit boards and parts
3. Promote the use of advanced building techniques
4. Has better electrical performance and signal accuracy
5. Better reliability
6, can improve thermal performance
7. Can improve RFI/EMI/ESD (RFI/EMI/ESD)

 

 

Often encountered materials in PCB assembly service

  • FR-2phenolic paper or phenolic cotton paper, paper impregnated with a phenol formaldehyde resin. Common in consumer electronics with single-sided boards. Electrical properties inferior to FR-4. Poor arc resistance. Generally rated to 105 °C.
  • FR-4, a woven fiberglass cloth impregnated with an epoxy resin. Low water absorption (up to about 0.15%), good insulation properties, good arc resistance. Very common. Several grades with somewhat different properties are available. Typically rated to 130 °C.
  • Aluminum, or metal core board or insulated metal substrate (IMS), clad with thermally conductive thin dielectric - used for parts requiring significant cooling - power switches, LEDs. Consists of usually single, sometimes double layer thin circuit board based on e.g. FR-4, laminated on aluminum sheet metal, commonly 0.8, 1, 1.5, 2 or 3 mm thick. The thicker laminates sometimes also come with thicker copper metalization.
  • Flexible substrates - can be a standalone copper-clad foil or can be laminated to a thin stiffener, e.g. 50-130 µm
    • Kapton or UPILEX, a polyimide foil. Used for flexible printed circuits, in this form common in small form-factor consumer electronics or for flexible interconnects. Resistant to high temperatures.
    • Pyralux, a polyimide-fluoropolymer composite foil. Copper layer can delaminate during soldering.

 

 

Specification

 

ArticleDescriptionCapability
MaterialLaminate materialsFR4, High TG FR4, High Frequency, Alum, FPC...
Board CuttingNumber of layers1-48
Min.thickness for inner layers
(Cu thickness are excluded)
0.003”(0.07mm)
Board ThicknessStandard(0.1-4mm±10%)
Min.Single/Double:0.008±0.004”
4layer:0.01±0.008”
8layer:0.01±0.008”
Bow and twistno more than 7/1000
Copper WeightOuter Cu weight0.5-4 0z
Inner Cu weight0.5-3 0z
DrillingMin size0.0078”(0.2mm)
Drill deviation±0.002″(0.05mm)
PTH hole tolerance±0.002″(0.005mm)
NPTH hole tolerance±0.002″(0.005mm)
Solder MaskColorGreen,white,black,red,blue…
Min solder mask clearanace0.003″(0.07mm)
Thickness(0.012*0.017mm)
SilkscreenColorwhite,black,yellow,blue…
Min size0.006″(0.15mm)
Max Size of Finish Board700*460mm
Surface FinishHASL,ENIG,immersion silver,immersion tin,OSP…
PCB OutlineSquare,circle,irregular(with jigs)
PackageQFN,BGA,SSOP,PLCC,LGA

 

Company Introduction

CESGATE is a team with more than 10 years experience in the field. We owns abundant experiences for serving overseas customers from industrial automatic control, communication, medical, Auto and consumer electronics,etc. We test our product strictly to guarantee the quality to our customers. We accumulate high reputation during our cooperation.You will achieve following value-added services when you cooperate with us:

One-stop PCB/PCBA Service
Optimizing your PCB design during production
Satisfied quality with competitive prices
Instant response in both quotation and delivery
Increase your business with our powerful support

 

 

 

FAQ

 

 

Q: What certificates do you have?
CESGATE: We have ISO 9001, ISO14001 and UL certificates.
Q: Why choose us?
CESGATE: Professional and experienced R&D team. Advanced production equipment, scientific and reasonable process flow.
Reliable and strict quality control system. We test all our products before shipment to make sure everything is in perfect condition.
Q: What does CESGATE need for a customized PCB order?
CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products.
Q: What are the types of solder mask?
CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type.
Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.

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