Tally Prime Bom Prototype HDI PCB Symphony Cooler PCB Board HASL LF

Symphony Cooler Pcb Board Price Assembly Prototype HDI PCB Tally Prime Bom

Types and uses of PCBD
(A) 4-layer board
The substrate material is mainly epoxy glass fiber cloth. The main uses are personal computers, medical electronic equipment, measuring instruments, semiconductor testing machines, numerical control machines, electronic switches, communication machines, memory circuit boards, IC cards, etc.
(B) 6-8 layer board
The substrate material is still mainly epoxy resin glass fiber cloth. Most of them are used in electronic switches, semiconductor testing machines, mid-range personal computers, engineering workstations and other machines.
(C) 10 layers or more
The material is mainly glass benzene resin material, or epoxy resin is used as the multi-layer PCB substrate material. The application of this type of PCB is special, and it is used in large industrial computers, high-speed computers, defense machines, communication machines, etc.

Residential and Storefront Applications

In addition to the uses listed above, HDI PCB LEDs are gaining popularity in homes and businesses in the form of signage and displays. Smart LED lighting is an inexpensive way for homeowners to effectively light their homes, and customizable LED displays can direct business to storefronts.
While LEDs are useful in a variety of applications, LEDs tend to be temperature-sensitive. As the average temperature of the fixture increases, the lifespan of LED bulbs decreases. While many traditional PCBs provide excellent functionality, not all HDI PCBs are suitable for LED applications. When paired with LEDs, some PCBs may not transfer heat fast enough to provide a stable temperature environment for the LEDs to operate at peak efficiency. To perform optimally in lighting applications, a PCB designed for LEDs must be designed to maximize heat transfer capabilities.
For this, an aluminum back HDI PCB is the perfect solution. Most high lumen output LED applications use aluminum back PCBs, primarily for the higher levels of heat transfer that can be achieved with aluminum PCBs. In this way, the PCB does not require additional heat sinks in the design, but other heat sinks can be added to further improve the heat transfer capability of the HDI PCB. However, incorporating the heat sink into the PCB base itself allows manufacturers and end users to achieve more compact designs at a lower cost.

PCB Capacities and Technical Specification

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