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AOI Test OEM PCBA Semiconductor PCB One Stop Fabrication

Chengdu Cesgate Technology Co., Ltd

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Address: 3602, Unit 1, Building 2, Phase 3, Longhu Zichen Xiangsong, Huazhaobi Xiaheng Street, Jinniu District, Chengdu, China

Contact name:Sia Li

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AOI Test OEM PCBA Semiconductor PCB One Stop Fabrication

Country/Region china
City & Province chengdu sichuan
Categories Electronics Production Machinery
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Product Details

AOI Test OEM PCBA Manufacturering Semiconductor PCB One Stop Fabrication

 

 

Semiconductor boards differ from most other custom PCBAs because they are not intended for a single application. Instead, these boards are meant to be applied widely and across many different industries. The boards may be used as samples to display capabilities, or they may be installed into a larger system for faster bringup. When designing and building semiconductor boards, reliability is the key attribute, regardless of how the board is utilized.

 

 

Semiconductor PCBA Manufacturing Service Requirements

 

Build Flexibility


Semiconductor PCB must often transmit, receive, and process various signal types, interconnect using different types of connectors, and perform in unique environments. Therefore, your CM must excel in all types of board building, and they must meet IPC Class 1, 2, and 3 performance level standards. Additionally, they should be able to manufacture non-standard form factors.


Secure Component Procurement


For turnkey, your CM is responsible for procuring components (with the possible exception of exotic components) from a secure supply chain that is free of counterfeits and obsolete components.
Quality Assembly


Semiconductor PCB reliability is only attainable with quality assembly. Your board’s ability to last throughout its intended lifecycle depends on high-quality solder connections for both SMDs and through-hole components.


Process Agility


Design changes may be required to add or improve functionality or meet customer demands. Time may be of the essence here, and your CM needs an agile manufacturing process that can incorporate changes quickly with minimal process adjustments or the need for additional equipment.


Accurate and Accessible Documentation


As semiconductor PCB may experience multiple revisions or integration into other design projects, accurate and thorough documentation is mandatory.

 

While other considerations may arise when assessing a CM’s ability to meet your turnkey semiconductor service needs, ensuring it can satisfy the requirements listed above is essential.

 

 

PCB Capacities and Technical Specification

 

NO.ItemsCapabilities
1Layers2-68L
2Maximum machining size600mm*1200mm
3Board thickness0.2mm-6.5mm
4Copper thickness0.5oz-28oz
5Min trace/space2.0mil/2.0mil
6Minimum finished aperture0. 10mm
7Maximum thickness to diameter ratio15:1
8Via treatmentVia, blind&buried via, via in pad, Copper in via …
9Surface finish/treatmentHASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10Base MaterialFR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11Solder mask colorGreen.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12Testing ServiceAOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13Profiling PunchingRouting,V-CUT,Beveling
14Bow&twist≤0.5%
15HDI type1+n+1,2+n+2,3+n+3
16Min mechanical aperture0.1mm
17Min laser aperture0.075mm

 

 

 

FAQ

 

Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
Q: What are the types of solder mask?
CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type.
Q: What are the common substrates of CESGATE?
A:Tg-140: ISOLA FR402 / NAN-YA NP-140
Tg-150: ISOLA IS400 / NAN-YA NP-155
Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F

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