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[China]
Trade Verify
Address: Liwu Industrial Park, Yuanzhou Town, Boluo County, Huizhou City, Guangdong Provice, China.
Contact name:Amy
Winsmart Electronic Co.,Ltd |
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Verified Suppliers
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Hot Bar Soldering Equipment PCB Reflow Soldering Machine 80mm Length
Hot Bar Soldering Machine Introduction:
Our hot bar bonding and soldering machines, easy to use, robust and economical for bonding flex to rigid assemnlies such as flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB, Wires to PCB.
Hot Bar Soldering Machine Features:
1. Unique pulse heat technology provides fastest soldering head heating.
2. Programmable soldering temperature, heat-up rate and time duration for a wide range of products.
3. Thermocouple is fixed in close proximity to the working surface & the thermode, thus providing accurate temperature feedback control.
4. Closed Loop PID temperature control with clearly visible LED display.
5. Soldering time can be programmable and is triggered by temperature.
6. Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.
7. Programmable pressure switch with LCD display for precise force control.
8. CCD camera system with magnification lens can be retrofitted for fine-pitch positioning.
Hot Bar Soldering Machine Specification:
| Machine size | 500×500×600mm |
| Working area | Max 200*170mm |
| Machine weight | 62Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 1 |
| Thermode head size | Max 40*3mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
| CE certificate | Yes |
| Warranty | 1 year |
| Condition | 100% new |
| Origin | China |
Hot Bar Soldering Machine Applications:
1. FFC to PCB
2. FPC to PCB
3. Wires to PCB
4. HSC to PCB
5. HSC to LCD
Heat Sealing Paratmeter:
| Temperature range | 50℃ to 400℃ |
| Temperature accuracy | ±1°C |
| Bond time | 0-12 seconds |
| Bond air pressure | 0.4-0.6MPa |
| Pressure accuracy | ±0.05MPa |
| Max bond force | 1100N |
Hot Bar Soldering Machine Thermode:
