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Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

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Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

Country/Region	china
City & Province	suzhou jiangsu
Categories	Electronics Production Machinery

Product Details

Basic Description

The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconductor chip, PCB, EMC wire frame and other materials with high accuracy by using spindle’s high-speed rotation driving the cutting blade.

Operation procedures

Wafer or Strip Tape mounting Dicing Cleaning UV seperation

Description of Semi-auto dicing

The semi-auto dicing system, refers to a dicing system that loader and unloader by hand and only the procedure is automated in the process of dicing. The system is not equipped with automatic cleaning, drying, etc.

Main procedures

Feeding by hand Position align Auto-cutting Unloading by hand

1.Operator manually place the material being cut on work platform.

2.The cutting position is automatically calibrated.

3.Press the start button to automatically complete the dicing process of material.

4.Operator take the material manually being cut from the work platform.

Applications

Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .

Ceramic substrate Silicon rubber Lead frame

Silicon wafer PCB Glass

Operating Requirements

1.Please use the clean compressed air that its atmospheric pressure dew point is in the -10 ~ -20℃, and the residual oil is divided into 0.1ppm, the filtering accuracy is above 0.01um/99.5%.

2.Please use the equipment in a room of temperature between 20 ~ 25 ℃, and its fluctuation range control at ±1℃.

3.Please control the temperature of the cutting water at 22 ~ 27 ℃(variation ranges in ±1℃ ), the cooling water at 20 ~ 25 DEG C (variation ranges within plus or ±1℃).

4.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

5.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

6.Please follow the product manual we provided for operation strictly.

Semi-dicing system YSL-1000SD Features of products

1.Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.

2.Can meet the high precision cutting maximum diameter of 300 mm materials.

3.High rigidity structure design is adopted to ensure high precision and high stability of cutting process.

4.CCD automatic align.

5.Real-time monitoring of the system's air pressure, water pressure, current and other values to avoid spindle damage.
6.Cutting Spindle : 2.4 kw × 1set (Max: 60,000 rpm)
7.Repeat positioning accuracy: 0.001mm
8.Cutting speed: 0.05 ~ 400 mm/sec
9.Standard matching blade: 2 Inch (Max: 3 Inch)

Case Sharing

System compositionproject		Unit	Specification
Dimensions of processing		mm	Φ300
Dimensions of working platform		mm	Φ350
X-axis	Working stroke	mm	340
	Cutting speed	mm/sec	0.05 ~ 400
	Resolution	mm	0.0001
Y-axis	Working stroke	mm	310
	Resolution	mm	0.0001
	Repeat positioning accuracy	mm	0.001 / 310
Z-axis	Working stroke	mm	60 (2 Inch blade)
Z-axis	Resolution	mm	0.0001
Θ-axis	Angle of rotation	Deg	360
Spindle	Power	KW	2.4
Spindle	Speed	Rpm	5000 ~ 60000
Machine’s specifications	Power supply	V	3P 220 (50 ~ 60 Hz)
	Machine power	KW	4
	Power air pressure	MPa	0.5 ~ 0.6
	Air consumption	L/min	200
	Cutting water consumption	L/min	4
	Cooling water consumption	L/min	1.5
	Physical dimension	mm	1040×1080×1750
	Machine net weight	KG	850