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8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

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Address: Building H, GuoRui Pioneering Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan, Suzhou,Jiangsu,China.

Contact name:Eva liu

YUSH Electronic Technology Co.,Ltd

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8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

Country/Region	china
City & Province	suzhou jiangsu

Product Details

Automatic Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic

Features of products

• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.

• Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.

• Can meet the high precision cutting maximum diameter of 300 mm materials.

• Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.

• CCD automatic align.

• Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.

• Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)

• Repeat positioning accuracy : 0.001mm

• Cutting speed: 0.05 ~ 400 mm/sec

• Each magazine can be stored 20 ~ 30 layers of frame.

• Standard collocation of using blade size: 2 Inch(Max:3 Inch)

Specs:

x-axis	Working stroke	500mm
	cutting speed	0.05 ~ 400mm/sec
	resolution	0.0001mm
y-axis	Working stroke	650mm
	resolution	0.0001mm
	Repeat positioning accuracy	0.001 / 310mm
z-axis	Working stroke	60 (2 Inch blades)mm
	resolution	0.0001m
Θ-axis	Angle of rotation	360deg

Dimensions of processing	Φ300mm
Dimensions of working platform	Φ350
power	2.4×2 set KW
speed	5,000 ~ 60,000 rpm
power supply	3P , 220 (50 ~ 60 Hz) V
machine power	8KW
Power air pressure	0.6 ~ 0.68MPa
Air consumption	250L/min
Cutting water consumption	6.5L/min
cooling water consumption	2.5L/min
(W×D×H) physical dimension	1262×1704×2023
machine net weight	1000KG

Process description

1.Mechanism remove it from magazine,and send it to the temporary table.

2.Unloading robot will move the dicing material to chunk. for dicing process.

3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.

4.Unloading robot send material having been cleaned and dried to the temporary table.

5.Robot send the dicing material to the magazine .

Optional equipment

1,Function of blade damage detection;

2,Automatic setting function;

3,Dicing visual function;

4, Using dicing blade with 3 Inch.

Case Sharing

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