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Immersion Gold Multilayer PCB Board For Vehicle Green Solder Mask OEM / ODM

Shenzhen Lefang Electronics Co., Ltd
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Address: A1-405 (Exit A, Fuyong Metro Station), Fuhai Information Port, Bao'an District, Shenzhen. 10mins from Shenzhen Bao'an International Airport by subway

Contact name:Cyan Hong

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Shenzhen Lefang Electronics Co., Ltd

Immersion Gold Multilayer PCB Board For Vehicle Green Solder Mask OEM / ODM

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

 

 

Multilayer Immersion Gold Circuit Board PCB for Vehicle ISO / TS16949 UL

 

 

For the green solder mask 4 layers Multilayer PCB Board, the board thickness is 1.6 mm and the copper thickness is 1 OZ / 35 µm. Also, the surface treatment of this Multilayer PCB Board is Immersion Gold. Its minimum aperture is 0.4 mm, and the line width and space is 0.2 mm.

 

 

 

 

        What We Can Do for You?
 
 
With over 18 years experience, we offer OEM & ODM PCB Layout, PCB Design, PCB manufacturing and
 
PCB Assembly in single-sided PCB Board, double-sided PCB and Multilayer Printed Circuit Board service to
 
our customers, with total production capacity of 290,000 sqm/month.

 

 

        How to get quick quotation?

 

        Step 1    Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
        Step 2    Also please provide us the below details for quick quotation:

                Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

                Material brand: SY / KB / Rogers  (optional)
                Material Specification:High Tg / copper based / aluminum based or others (optional)
                Board thickness: 0.1 - 6.0 mm
                Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
                Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
                Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
                Board size and quantity

 

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

 

       SAMPLE:

 

Board Basic Info - SAMPLE

                       Board material

Fr - 4

                       Material brand

KB

                       Material Specification

Tg 170

                       Board thickness

1.6 mm

                       Copper thickness

1 Oz

                       Surface Treatment

ENIG

                       Solder mask / sSilk print

Green / White

                       Board size

100 mm * 100 mm

                       Quantity

10k

 

       
        
        Lead Time
 
Layer countSample lead time/workdayBatch lead time/workday
1-2L26
4L58
6L59
8L610
10L810
12L812
14L1015
16L1018
18-40L (Up to difficulty)at least 18at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

 

 

        How many advanced automated equipments do we have?

 

-- We have spent massively on purchasing below advanced automated production equipments.

 

        Equipment NamePlant in ShenzhenPlant in Dongguan
        CCD exposure machine812
        AOI test machine68
        Mechanical drilling rig2653
        Automatic edge finishing machine22
        Pressing machine22
        VCP02
        Electroplating line12
        CNC routing machine1212
        Automatic tester1016

 

 

Now send us your inquiry, and you will be replied within 8 hours!

 

 

 

 

 

 

Little knowledge - Multilayer PCB Board

Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology. 

A very sophisticated and complex methodology came from the base platform of double sided plated.

This methodology would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size. 

The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

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