Active Member
|
[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
|
|
| Base Materia | FR-4 |
| Board Thickness | 1.2+/-0.12mm |
| size | 190mm*90mm |
| Min. Hole Size | 0.25mm |
| Min. Line Width | 0.12mm |
| Min. Line Spacing | 0.134mm |
| Min. Hole Copper | 22um |
| Copper Thickness | 1OZ |
| Items | Speci. | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | |
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | |
| Min PAD (inner layer) | 5 mil(0.13mm) | |
| Min thickness(inner layer) | 4 mil(0.1mm) | |
| Inner copper thickness | 1~4 oz | |
| Outer copper thickness | 0.5~6 oz | |
| Finished board thickness | 0.4-3.2 mm | |
Board thickness tolerance control | ±0.10 mm | ±0.10 mm |
| ±10% | ±10% | |
| ±10% | ±10% | |
| Inner layer treatment | brown oxidation | |
| Layer count Capability | 1-30 LAYER | |
| alignment between ML | ±2mil | |
| Min drilling | 0.15 mm | |
| Min finished hole | 0.1 mm | |
| Hole precision | ±2 mil(±50 um) | |
| tolerance for Slot | ±3 mil(±75 um) | |
| tolerance for PTH | ±3 mil(±75um) | |
| tolerance for NPTH | ±2mil(±50um) | |
| Max Aspect Ratio for PTH | 8:1 | |
| Hole wall copper thickness | 15-50um | |
| Alignment of outer layers | 4mil/4mil | |
| Min trace width/space for outer layer | 4mil/4mil | |
| Tolerance of Etching | +/-10% | |
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) |
| at trace corner | ≥0.2mil(5um) | |
| On base material | ≤+1.2mil Finished thickness | |
| Hardness of solder mask | 6H | |
| Alignment of solder mask film | ±2mil(+/-50um) | |
| Min width of solder mask bridge | 4mil(100um) | |
| Max hole with solder plug | 0.5mm | |
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | |
| Max Nickel thickness for Gold finger | 280u"(7um) | |
| Max gold thickness for Gold finger | 30u"(0.75um) | |
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | |
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | |
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | |
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | |
| bow and twist | 0.75% | |
Over 10 years' manufacturing experience
Assembly provided
100% quality tested before shipment
Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
Our Products meet the RoHS & WEEE lead-free requirement.
Small Order accepted
3 weeks for massive production; 10 days for sample since material
prepared
Urgent case or spread delivery schedule will be updated per
negociation then
10OZ PCB 4.0mm PCB Blind vias PCB
Counter Sink Hole PCB Immersion Silver PCB
Metal Core 2 Layer Bule Immersion Silver Substrate PCB
FR4 Single Side Layer PCB
10 layer PCB gold plating PCB edge plating PCB
Fr-4 Board Edge Immersion Gold Suppliers
