High Frequency PCB with 0.1mm vias holes HDI PCB Precision PCB

Product introduction layer: 8 layer

thickness: 2.0 mm

line width/line distance: 0.075 mm / 0.075 mm

BGA: 8 8 mil

mil/material: copper thick FR - 4:3

oz size: 0.2 mm

process: zedoary

impedance: 50 ohms to 100 ohms resistance

welding/character color: dark green white oil

products used in: industrial control equipment of sandwich plate method by inner commonly graphics to do first, and then to print etching made single side or double side board, and included in the specified between layers, then through heatingPressure and glue, as to after drilling and double panel of plated through hole method the same basic method with that of the 1960 s can not change much, but as the material and process technology (for example: adhesive bonding technology to solve the drilling produce rubber improved slag film) more hasten is mature, attached to the characteristics of sandwich plate is more diverse.

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