Active Member
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[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
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Item specifics
| Condition: | New: A brand-new, unused, unopened and undamaged item in original retail packaging (where packaging is ... Read more | Type: | Board |
| Amplifier Class: | 5 Times | Compatible Brand: | Universal |
| Bundle Listing: | No | Brand: | Unbranded |
| Country/Region of Manufacture: | China | MPN: | Does Not Apply |
| UPC: | Does not apply | ISBN: | Does not apply |
| EAN: | Does not apply |
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| Port: | Shenzhen, China |
| Production Capacity: | 50000pieces/Month |
| Payment Terms: | L/C, T/T, Western Union, Paypal, Money Gram |
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
| Material: | Fiberglass Epoxy Resin + Polyimide Resin |
| Application: | Consumer Electronics |
| Flame Retardant Properties: | V0 |
| Mechanical Rigid: | Rigid |
Product Description:
| 1 | Layer Count | 1-30Layers | |
| 2 | HDI Type | 1+N+1, 2+N+2 | |
| 3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
| 4 | Board thickness | 0.2~5.0mm | |
| 5 | Board Size | Max | 600*1000mm (24"x40") |
| Min | 30x50mm | ||
| 6 | Copper Thickness | Outer layer | 1oz~6oz |
| Inner layer | Hoz~5oz | ||
| 7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
| 8 | Finished Hole size | Mechanical | 0.20~6.30mm |
| Laser | 5mil, 6mil | ||
| 9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
| 10 | Aspect Ratio | 10:1 | |
| 11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
| NPTH | ±0.05mm (2mil) | ||
| 12 | Hole Position Tolerance | ±0.05mm (2mil) | |
| 13 | Bow & Twist | ≤0.75% | |
| 14 | Peel strength | 1.4N/mm | |
| 15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
| 16 | Test Voltage | 50-300V | |
| 17 | Soldermask color | Green, Red, B | |
Product Description:
| 1 | Layer Count | 1-30Layers | |
| 2 | HDI Type | 1+N+1, 2+N+2 | |
| 3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
| 4 | Board thickness | 0.2~5.0mm | |
| 5 | Board Size | Max | 600*1000mm (24"x40") |
| Min | 30x50mm | ||
| 6 | Copper Thickness | Outer layer | 1oz~6oz |
| Inner layer | Hoz~5oz | ||
| 7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
| 8 | Finished Hole size | Mechanical | 0.20~6.30mm |
| Laser | 5mil, 6mil | ||
| 9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
| 10 | Aspect Ratio | 10:1 | |
| 11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
| NPTH | ±0.05mm (2mil) | ||
| 12 | Hole Position Tolerance | ±0.05mm (2mil) | |
| 13 | Bow & Twist | ≤0.75% | |
| 14 | Peel strength | 1.4N/mm | |
| 15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
| 16 | Test Voltage | 50-300V | |
| 17 | Soldermask color | Green, Red, B | |
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