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Turn Key 10 Layers Flexible Printed Circuit Board Assembly

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[China]

Address: Shenzhen Guangming yulv Village Road Jade Spring beauty industrial district 18-1 building

Contact name:Fu

Shenzhen Jingbang Technology Co. , Ltd

Turn Key 10 Layers Flexible Printed Circuit Board Assembly

Country/Region	china
City & Province	shenzhen guangdong

Product Details

Multilayer Pcb Fabrication Process Printed Circuit Board Assembly Multi 10 Layer Pcb

PCBA Technical Capabilities:

Sercive	PCB and SMT assembly with one-stop service
Surface Finish	HASL,ENIG,immersion silver,immersion tin,OSP…
Components	Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days service
Max size of finish board	700*460mm
File Formats	Bill of Materials(BOM) Gerber files Pick-N-Place File(XYRS)
Type of service	Turn-key, Partial Turn-key or consignment
Component Packaging	Cut Tape Tube Reels Loose Parts
Turn Time	Same day service to 15 days service
Testing	X-ray,AOI Test,Functional test
PCB+ assembly process	Drilling-----Exposure----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----WaveSoldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

PCB board manufacture and PCBA service:

* PCB board made, circuit board parts purchased by us
* Electronic testing circuit board or PCBA
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-free
* One stop service from PCB design, PCB layout, PCB manufacture, components
purchasing, PCB assembly, test, packing and PCB delivery
* Electronic manufacturing service

Detailed terms for PCB assembly:

* Technical requirement:
1. Professional surface-mounting and through-hole soldering technology
2. Various sizes like 1206, 0805, 0603 components SMT technology
3. ICT (in circuit test), FCT (functional circuit test) technology
4. PCB assembly with UL, CE, FCC, RoHS approval
5. Nitrogen gas reflow soldering technology for SMT
6. High standard SMT and solder assembly line
7. High density interconnected board placement technology capacity