Dongguan MENTO Intelligent Technology Co., Ltd. |
Verified Suppliers
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M2020-2012EL Mini LED appearance & luminescence all-in-one
Model | M2020-2012EL | |||
Detection capacity | Inspection items | Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity. | Bad die, over luminescence, under luminescence, chroma anomaly | |
Detection method | Image processing, machine learning | |||
Optical system | Camera | 20MP | 12MP | |
telecentric lens | High resolution bi-telecentric lens | |||
Resolution | 4um (2.4um~5um optional) | 15μm(10um~18um optional) | ||
Light Source | RGB(Customizable) | |||
Efficiency | Stop then go:3FOV/s | |||
Computer Configuration | Mainframe | CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6GB, SSD:250G, HDD:2T | CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6GB, SSD:250G, HDD:2T | |
Monitor | 22 "LED | |||
Operating System | Ubuntu/Windows 10 Professional | |||
Detection performance | PCB thickness | 1~5mm | ||
Maximum allowable component height | 20mm upper, 30mm lower (Customizable) | |||
Drive | Servo motor + Screw guide | |||
Movement speed | Max :600mm/s | |||
PCB fixture height | 900±20mm(Dual station, adjustable track width) | |||
Parameters | PCB size | Max: 350mmx300mm | Max: 370mmx350mm | |
Power supply | AC220V/50Hz/2000W | |||
Dimensions | W1330xD1360xH1650mm (excluding warning light) | |||
Weight | 1600KG | |||
Air Pressure Requirement | ≥0.5Mpa | |||
Environmental requirements | Temperature:5~40℃, RH 25%~80%(no frost) | |||
Upstream and downstream equipment communication | Standard SMEMA interface / data communication with die bonder |
Pad measurement/Pad inspection /Solder paste printer/SPI/Die bonder/Pre-reflow AOI/
Reflow oven/Post-reflow AOI /Luminescence inspection/Colloid inspection/Laser Marker/Rework