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Plasma Surface Treatment Equipment For Semiconductor Optoelectronic And PCB Circuit Boards

Shanghai Liangui Technology Co., Ltd.

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Address: No. 1181, Zhaoxian Road, Jiading District, Shanghai city

Contact name:Shelly Xiao

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Plasma Surface Treatment Equipment For Semiconductor Optoelectronic And PCB Circuit Boards

Country/Region china
City & Province shanghai shanghai
Categories Level Measuring Instruments
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Product Details

Semiconductor Optoelectronic and PCB Circuit Boards Surface Treatment Equipment

 

1. Product Introduction

 

The atmospheric plasma cleaning machine is composed of plasma generator, gas conveying system and plasma spray gun.Atmospheric plasma cleaning machine depends on electric energy, produce high voltage, high frequency energy.These energies generate low temperature plasma in the activated and controlled glow discharge in the nozzle steel tube, and the plasma is sprayed to the treated surface with the help of the compression space, resulting in the corresponding physical and chemical changes on the treated surface.The surface of the treated object is cleaned, oil, additives and other ingredients are removed, and surface static electricity is eliminated.At the same time, the surface has been activated, increased adhesion, is conducive to the product bonding, spraying, printing and sealing.

 

    

 

 

2. Characteristics 

  • German circuit technology:Imported high voltage power supply circuit technology, produce high density neutral plasma, to ensure superior cleaning effect
  • High quality core components:Spray gun adopts imported alloy material, high temperature resistance, oxidation resistance, long service life.
  • Clean at low temperature without damage:Ultra-low temperature cleaning (can be controlled within 50℃) will not cause damage to the product surface.
  • Comprehensive safety protection: Functions of Temperature safety protection, overload protection, air pressure disorder protection , short circuit break alarm protection, all kinds of misoperation protection.

3. Technical Parameters: 

 

NOItemspecification 
Specifications of Plasma control power supply
 1SIZE(L*W*H)490mm×170mm×356mm 
 2Weight21kg 
 3Power supplyAC220V,50-60Hz,3wire 
 4output power100W--1000W(Adjustable) 
 5Plasmaeffective diameter2mm-10mmAdjustable
 6Working intake joint4×6mm Connector 
 7Usage amount of working gasCDA:46±6L/min 
 8Air pressure4.20±0./kg/cm 
 9Configuration Space

Store in a well-ventilated place (ambient temperature

less than 30 degrees).

Reserve left, right and above the space with more than

150mm heat dissipation,

reserve 150mm rear line space

 
 Plasma gunjet specifications:
1SIZE(H)85mm×280mm 
  2Weight<2.85kg 
  3Distance between power supply and gunjet3m 
Other specifications:
 1Effective cleaning range20-80mmOptional
 2Processing speed50-300mm/sec 
 3Processing distance2mm-10mm to the object 

 

4. Type of Installation 

 

   

                         inglestation Plasma Processor                                                               double-stationPlasma Processor

 

 

                                   

                 Safety cover and exhaust can be customized                                        online on the production line

 

 

5. Principle of Plasma Cleaning

  • Introduction of Plasma:

Plasma is a kind of existing state of substance. It is usually juxtaposed with the solid, liquid and gaseous states of a substance and is called the "fourth state of matter". It can use the plasma high-energy particles and the material surface physical and chemical reaction to realize the material surface activation, etching, decontamination and other processes, as well as the material friction coefficient, adhesion and hydrophilic and other surface properties of the purpose of improvement.

 

 

 

  • Cleaning Effect of Plasma:

The surface of the treated material is cleaned chemically and physically by making the plasma and material surface contact and react using plasma cleaning technology (low temperature plasma characteristics) in order to improve surface smoothness, implant new chemical functional group and realize etching.

 

   (1)  Cleaning and activation for material surface

 

     

 

 (2) Form new functional group- Chemical effect.

       

If reactant gas is introduced into electricity-discharged gas, complex chemical reaction will happen to the surface of activated material. New functional groups will be introduced, such as hydrocarbyl, amidogen and carboxyl, all of which are active groups and could improve the activity of material surface significantly.

 

(3) Plasma etching.

Plasma etching means a process of removing volatile gaseous substance generated by creating plasma of a kind of proper gas chosen and substance on solid surface.

Plasma etching technique is actually a kind of reactive plasma process. The so-called direct plasma, also called reactive ion etching, is a kind of form under which plasma is etched directly. Its main advantages include high etching rate and evenness. The technological parameters of plasma play a vital role in etching effect.

 

 

6. Plasma Cleaning Process: 

 

 

7. Plasma Cleaning Advantages:

  • It replaces the traditional wet cleaning technology, and is green and environmentally friendly (containing no VOC).
  • Gas serves as reaction medium so operation cost is low (oxygen).
  • Broad range of application; treatment object and base material needn’t to be distinguished (material diagram).
  • High cleaning efficiency and easy to realize automation.
  • Improve material surface performance and adhesive force while removing dirt.

8. Comparison Before and After Plasma Treatment: 

 

The contact Angle of liquid on the surface of solid material is an important parameter to measure the wettability of liquid on the surface of material.If θ<90°,the solid surface is hydrophilic, and the smaller the Angle, the better the wettability; if θ>90°, the solid surface is hydrophobic.

 

 

The measurement of the dyne value is very common in printing, coating, laminating, welding and other applications. It can reflect the ability of the material surface to bond easily. In general, the greater the dyne value, the better the bonding performance of the surface with another material.

 

 

9. Common Applications: 

       

                     Surface modification of polymer materials  Improves surface bonding property

 

                    

         Removal of oxide residue of electronic components, improve the bond quality and enhance the bonding effect.

 

               

                            Glass substrates remove organic contaminants

 

 

                 

                                     Removal of oil from metal surfaces

 

                   

                                   Graphene and other powder cleaning modification

 

                       

 

                                              PDMS Surface activated bonding

 

 

10. Qaulity Assurance and After Salse Services: 

 

1 year warranty,If the equipment fails during the warranty period,supplier should arrange personnelto follow up and deal with until troubleshooting.

1) Accessories and Information with equipment.

When the equipment is delivered, the supplier shall provide a complete set of technical documents concerning operation, commissioning and maintenance, including operation and maintenance manuals.The maintenance manual should contain circuit diagram, gas circuit diagram and pipeline diagram.

2) The installation

Provide all details needed to prepare for site equipment installation.

3) Training

During installation, training can be provided remotely, including normal operation, repair and maintenance, analysis of tank problems and emergency procedures.

4) Equipment delivery to use and after-sales technical service

Supplier shall provide the documents of equipment installation, operation and maintenance, and technical support for operation training.Also a copy of the warranty indicating the effective date and coverage of the warranty and the contact person of Seller.

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