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LED PCB aluminum board LED PCBA assembly round LED bulb PCB board

Shenzhen Yizhuo Electronics Co., Ltd
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[China] country

Address: Zone D, 3 / F, Building A, Zhentai Industrial City, No. 4 Jiangbian Industrial First Road, Songgang Street, Baoan District

Contact name:Yolanda

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Shenzhen Yizhuo Electronics Co., Ltd

LED PCB aluminum board LED PCBA assembly round LED bulb PCB board

Country/Region china
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Product Details

LED PCB aluminum board LED PCBA assembly round LED bulb PCB board

Key Specifications/Special Features:

  • Our Advantage
  • More than 19 years experience in electronic manufacturing services for PCB PCBA making
  • One-stop service | PCB Manufacturing | Components sourcing and PCB assembly to help you easily achieve your electronic products.
  • More than 1595 customers working with us in telecom, IoT, RF, smart control, security, medical, industrial, automotive,3G/4G/5G products.
  • Reasonable and stable price: have established a strong global electronics components supply chain that helps us get a reasonable and stable price
  • Quality assurance: more than 10years experienced engineering team and quality control team to ensure all products come out under control.
  • Professional replace-solution: help customers source professional replace-solution to achieve faster, lower cost with high-quality components purchasing agent service
  • No MOQ: Sample available for multilayer PCBs, PCB assemblies, and HDI PCBs
  • 100% inspection of all products
  • RFQs answered within 24 hours
  • Responses to the inquiry within two hours
  • Exporting to Europe and North and South America

Founded in 1998, HUA XING PCBA is providing one-stop contract manufacturing service: from PCBA to complete product assembly, including the following services to our client:

PCB manufacturing

Components sourcing

PCB assembly

Firmware programming

PCBA functional test

Plastic/Metal case assembly

Our factory has certificated ISO9001, ISO13485, IATF16949 quality management system standards to serve our clients in the telecommunications, automotive electronics, 3G/4G/5G products, IoT products, AI smart control products, RF, networking, security, Industrial control, medical Instrument, military products, computer peripherals, and other high-tech fields.


Technique parameter:
ItemTest itemTechnology requestUnitTest result
1Peel StrengthA≥ 1.8N/mm2
After thermal stress (260ordm; C)≥ 1.8N/mm1.8
2Blister test AfterThermal stress (260º C, 2min )No delaminating/Ok
3Flammability(A)FV-O/FV-O
4Thermal resistance≤ 2.0ordm;C /W1
5Surface ResistivityA≥ 1 × 10 5M Ω5 × 10 7
Constant humidity treatment≥ 1 × 10 5M Ω2 × 10 6
(90%,3 5 ordm;C,96h)
 
6Volume ResistivityA≥ 1 × 10 6M Ω· m4 × 10 8
Constant humidity treatment≥ 1 × 10 6M Ω· m5 × 10 7
(90%,3 5ordm;C ,96h)
 
7Dielectric Breakdown ( DC )≥ 28.5Kv/mm31
8Dielectric constant (1MHz )≤ 4.4/4.2
(40 ordm;C,93% , 96h )
 
9Dielectric dissipation factor (1MHz )≤ 0.03/0.02
(40 ordm;C, 93% ,96h )
 

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