Square HASL LED Ceiling Light PCB Board SMD SMT DIP Component Assembly

1.  Cutting laminate

1.  The process of material opening-cutting

2.  The purpose of cutting

•  Cut large-size incoming materials to the size required for production

3.  Precautions for cutting

①  Open the first piece to check its size

②  Look for scratches on aluminum surface and copper surface

③  Pay attention to the delamination and the front of the board

2.  Drilling

1.  Drilling process

•  Pinning-drilling-board inspection

2.  The purpose of drilling

•  Positioning and drilling of plates provides assistance for subsequent production processes and customer assembly

3.  Precautions for drilling

①  Check the number of holes and the size of holes

②  Avoid scratches on the sheet

③  Check the front of the aluminum surface and the deviation of the hole position

④  Check and replace the drill bit in time

⑤  The drilling is divided into two stages: first, after cutting, drill the peripheral tool hole; second, drill tool hole in the unit after solder mask

3.  Dry/wet film Developing

1.  Dry/wet film developing process

•  Grinding board-filming-exposure-development

2.   The purpose of dry/wet film developing

•   Show the parts needed to make the circuit on the sheet

3.  Precautions for dry/wet film developing

①  Check whether there is an open circuit after development

②  Check whether there is deviation in the development registration to prevent the occurrence of dry film breakage

③  Pay attention to the defective circuit caused by scratches on the board surface

④  Ensure that no air remains during exposure to prevent poor results

⑤  After exposure, keep still for more than 15 minutes before developing

4.  Acid/alkaline etching

1.  Acid/alkaline etching process

•  Etching-film removal-drying-board inspection

2.  Purpose of acid/alkaline etching

•  After imaging the dry/wet film, keep the required circuit parts and remove the excess parts other than the circuits. Pay attention to the corrosion of the etching solution on the aluminum substrate during acid etching.

3.  Precautions for acid/alkaline etching

①  Note whether the etching is not clean, or that the etching is excessive

②  Pay attention to line width and line thinness

③  Ensure that there is no oxidation or scratching on the copper surface

④  Remove the dry film to clean

5.  Silk screen solder mask, characters

1.  Silk screen solder mask and character process

•  Silk screen-pre-bake-exposure-development-characters

2.  The purpose of the silk screen solder mask and characters