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Laser Direct Imaging Printed Circuit Board 0.5-3.5mm Thickness ±10% Line Width Tolerance

Jiangsu GIS Laser Technologies Inc.,

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Address: Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou

Contact name:Tian

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Jiangsu GIS Laser Technologies Inc.,

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Laser Direct Imaging Printed Circuit Board 0.5-3.5mm Thickness ±10% Line Width Tolerance

Country/Region china
City & Province suzhou
Categories Switching Power Supply
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Product Details

Product Description:

Laser Direct Imaging PCB is a new type of printed circuit board (PCB) which uses a laser direct imaging technology to produce high-precision circuit board. With this advanced technology, the PCB can be accurately aligned, with solder mask color fixed, scale/auto scale/interval scale/partition alignment, and file format supported. The solder mask ink can last for 30s@600x500mm (24"×20"), while applicable process includes solder mask and outer.

The laser direct imaging technology applied in PCB production ensures high accuracy and precision even in small details. It is suitable for a variety of complex circuit board applications, such as double-sided and multi-layer circuit boards, as well as PAD (diameter: 0.5~3.0mm) alignment. Compared to traditional methods, the laser direct imaging technology has a higher accuracy, faster production time, and easier operation.

Laser Direct Imaging PCB is a reliable and cost-efficient product for PCB manufacturers. It has been widely adopted by customers around the world, and is known for its high-precision and cost-effectiveness. With its advanced technology and features, it is the perfect choice for PCB production.

 

Features:

  • Product Name: Laser Direct Imaging PCB
  • Alignment method: PAD(diameter: 0.5~3.0mm)
  • Board thickness: 0.5~3.5mm
  • Solder Mask Color: Fixed Scale/ Auto Scale / Interval Scale / Partition Alignment
  • Solder mask ink: 30s@600x500mm(24"×20")
  • Scale mode: White, Black, Yellow, Etc.
 

Technical Parameters:

ParameterValue
Solder bridge/solder opening50/75μm(process Condition)
Solder mask ink30s@600x500mm(24"×20")
Effective exposure area620x720mm(24"x28.5")
Board thickness0.5~3.5mm
Alignment methodPAD(diameter: 0.5~3.0mm)
Alignment accuracy±12um
Solder Mask ColorFixed Scale/ Auto Scale / Interval Scale / Partition Alignment
Laser powerMixing Wave Total Power 512W
ApplicationPCB,HDI,FPC
Line width tolerance±10%
 

Applications:

GIS DPX820SM Laser Direct Imaging PCB is the perfect choice for PCB, HDI, and FPC applications. It is designed with Suzhou, China as the place of origin, and features a solder mask ink of 30s@600x500mm(24"×20")and an alignment accuracy of ±12um. It supports file formats such as Solder Mask and Outer, making it an ideal choice for a wide variety of applications. Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging Print Board) is a new type of circuit board that utilizes a laser direct imaging technology to print the circuit board with high precision and accuracy. Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging Print Board) has the advantage of high speed, high precision, low cost, and strong compatibility. It is suitable for the production of various complex circuit boards, such as high-density interconnection (HDI) boards and flexible printed circuit boards (FPC). With its superior performance and accuracy, Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging Print Board) is the perfect choice for PCB, HDI, and FPC applications.

 

Customization:

GIS DPX820SM Laser Direct Imaging Printed Board offers outstanding performance with features such as solder mask ink with 30s@600x500mm(24"×20"), ±10% line width tolerance, applicable processes such as Solder Mask and Outer, and Solder Mask Color options such as Fixed Scale/ Auto Scale / Interval Scale / Partition Alignment. Moreover, it provides excellent solder bridge/solder opening performance with 50/75μm(process Condition).

If you are looking for a reliable and efficient Laser Direct Imaging Print Board, Laser Direct Imaging Circuit Board, or Laser Direct Imaging PCB, GIS DPX820SM Laser Direct Imaging Printed Board is the perfect choice.

 

Packing and Shipping:

The Laser Direct Imaging PCB product is packaged and shipped with extreme care to ensure that it reaches its destination in perfect condition. The PCB is wrapped in protective materials, such as bubble wrap, and placed in a box with additional padding. The box is labeled with the product details, including the product name and destination address. The box is then sealed and shipped with a reliable courier service.

 

FAQ:

  • Q: What is Laser Direct Imaging PCB?
  • A: Laser Direct Imaging PCB, produced by GIS with model number DPX820SM in Suzhou, China, is a high-precision printing technology with high-definition and low-cost characteristics.
  • Q: What is the advantage of GIS's Laser Direct Imaging PCB?
  • A: The advantage of GIS's Laser Direct Imaging PCB is that it has high precision printing, high definition and low cost.
  • Q: What materials are used in GIS's Laser Direct Imaging PCB?
  • A: GIS's Laser Direct Imaging PCB uses high-quality copper foil and green oil-based materials, which are environmentally friendly and safe.
  • Q: What is the printing process of GIS's Laser Direct Imaging PCB?
  • A: GIS's Laser Direct Imaging PCB printing process is that the laser beam scans the surface of the printed circuit board, and the computer is controlled to selectively remove the copper foil and expose the solder mask.
  • Q: What is the application of GIS's Laser Direct Imaging PCB?
  • A: GIS's Laser Direct Imaging PCB is widely used in the manufacture and maintenance of printed circuit boards in mobile phones, computers, electronic equipment, etc.

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