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512W Mixing Wave Laser Direct Imaging Circuit Board PAD Alignment 0.5~3.0mm Diameter

Jiangsu GIS Laser Technologies Inc.,

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Address: Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou

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512W Mixing Wave Laser Direct Imaging Circuit Board PAD Alignment 0.5~3.0mm Diameter

Country/Region china
City & Province suzhou
Categories Laser Equipment Parts
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Product Details

512W Mixing Wave Laser Direct Imaging Circuit Board PAD Alignment 0.5~3.0mm Diameter Solder Mask Ink 30s@600x500mm

Product Description:

Laser Direct Imaging (LDI) PCB is a type of direct imaging printing board that is used for PCB, HDI and FPC applications. It comes with an effective exposure area of 620x720mm (24) and has a variety of file formats to suit your needs. It is designed with PAD (diameter: 0.5~3.0mm) alignment method and has solder mask colors in fixed scale/auto scale/interval scale/partition alignment. Laser Direct Imaging Print Board is especially suitable for high-end PCB, HDI and FPC applications. It provides superior performance with high-quality results, meeting various special requirements. Laser Direct Imaging Circuit Board is highly reliable and durable, ensuring a long lifespan. With its innovative design, it also offers high-speed image processing capabilities.

 

Features:

  • Product Name: Laser Direct Imaging Printed Circuit Board
  • Solder bridge/solder opening: 50/75μm(process Condition)
  • Application: PCB,HDI,FPC
  • Scale mode: White, Black, Yellow, Etc.
  • Line width tolerance: ±10%
  • File format: File Format
 

Technical Parameters:

Product AttributesTechnical Parameters
Solder Mask ColourFixed Scale/ Auto Scale / Interval Scale / Partition Alignment
Laser PowerMixing Wave Total Power 512W
Line Width Tolerance±10%
Effective Exposure Area620x720mm(24
File FormatFile Format
Solder Mask Ink30s@600x500mm(24
Applicable ProcessSolder Mask, Outer
Board Thickness0.5~3.5mm
Alignment Accuracy±12um
Scale ModeWhite, Black, Yellow, Etc.
 

Applications:

GIS DPX820SM Laser Direct Imaging Printed Circuit Board is a cost-effective solution for advanced PCB manufacturing. It is made in Suzhou, China and has a line width tolerance of ±10%, an alignment accuracy of ±12um and a mixing wave total power of 512W. It comes with a variety of solder mask colors, including fixed scale, auto scale, interval scale and partition alignment. Furthermore, it supports a wide range of file formats.

The GIS DPX820SM Laser Direct Imaging Printed Circuit Board offers high precision, superior color accuracy and excellent performance. It is designed to fulfill the needs of the most demanding PCB manufacturing applications, providing unbeatable speed and accuracy. Its advanced technology allows for a greatly reduced manufacturing time and cost.

The GIS DPX820SM Laser Direct Imaging Printed Circuit Board is the perfect solution for any PCB manufacturing application. It is fast, efficient, and capable of producing high-quality prints. Its superior color accuracy and line width tolerance make it ideal for applications that require high precision and accuracy. Its advanced technology and wide range of file formats make it a great choice for any PCB manufacturing application.

 

Customization:

Laser Direct Imaging PCB

Brand Name: GIS

Model Number: DPX820SM

Place of Origin: Suzhou, China

Board Thickness: 0.5 - 3.5mm

Laser Power: Mixing Wave Total Power 512W

Effective Exposure Area: 620x720mm

Solder Bridge/Solder Opening: 50/75μm (Process Condition)

Scale Mode: White, Black, Yellow, Etc.

Laser Direct Imaging Circuit Board

GIS's Laser Direct Imaging Board (DPX820SM) is a printed circuit board that utilizes laser direct imaging technology. This technology provides high precision imaging with a board thickness range of 0.5 - 3.5mm and a mixing wave total power of 512W. The effective exposure area is 620x720mm and the solder bridge/solder opening is 50/75μm (process condition). The scale mode is available in white, black, yellow, etc.

Laser Direct Imaging Print Board

GIS's Laser Direct Imaging Print Board (DPX820SM) provides high quality imaging with a laser direct imaging technology. This technology provides a board thickness range of 0.5 - 3.5mm and a mixing wave total power of 512W. The effective exposure area is 620x720mm and the solder bridge/solder opening is 50/75μm (process condition). The scale mode is available in white, black, yellow, etc.

Laser Direct Imaging Printed Circuit Board

GIS's Laser Direct Imaging Printed Circuit Board (DPX820SM) is the perfect choice for high precision imaging. This laser direct imaging technology provides a board thickness range of 0.5 - 3.5mm and a mixing wave total power of 512W. The effective exposure area is 620x720mm and the solder bridge/solder opening is 50/75μm (process condition). The scale mode is available in white, black, yellow, etc.

 

Support and Services:

Laser Direct Imaging PCB Technical Support and Service

Our technical support team provides comprehensive support for Laser Direct Imaging PCB products. We provide services that range from troubleshooting and technical support to product installation and maintenance.

Our team of certified professionals can help you with all your Laser Direct Imaging PCB needs. We can provide assistance with installation and customization, as well as provide helpful tips and advice on how to maximize the benefits of the product.

Our team is available to answer your questions and provide advice on the best way to use the product. We also provide technical support through our online help desk and chat support. If you need any assistance, simply contact us and we'll be happy to provide assistance.

We strive to provide the best customer service and technical support possible. Our team of professionals is dedicated to ensuring that you are completely satisfied with the product and the service that we provide.

 

Packing and Shipping:

Packaging and Shipping for Laser Direct Imaging PCB

When shipping Laser Direct Imaging PCB, we use sturdy corrugated cardboard boxes to ensure protection against impacts, bumps, and other conditions, which may occur during transport. Furthermore, each box is custom-made to fit the size of the product, preventing any unnecessary movement inside the box during shipping.

In order to protect the product from environmental conditions, we include a layer of bubble wrap to provide an additional cushioning layer. Additionally, we use packing peanuts to fill in any gaps in the box, ensuring the product remains stationary. Finally, all packages are labeled with the sender and receiver's details, as well as a barcode for easy tracking.

In conclusion, when shipping Laser Direct Imaging PCB, we use sturdy cardboard boxes, bubble wrap, packing peanuts, and labels to ensure the product arrives in perfect condition.

FAQ:

Q: What is Laser Direct Imaging PCB?
A: Laser Direct Imaging PCB is a high-precision imaging solution for printed circuit boards (PCB) created by GIS, with model number DPX820SM, made in Suzhou, China.
Q: What advantages does Laser Direct Imaging PCB offer?
A: Laser Direct Imaging PCB offers superior imaging accuracy, lower production cost, faster imaging speed, and highly flexible design.
Q: What materials are compatible with Laser Direct Imaging PCB?
A: Laser Direct Imaging PCB is compatible with a variety of materials including copper, tin-plated copper, and aluminum.
Q: What applications can Laser Direct Imaging PCB be used for?
A: Laser Direct Imaging PCB can be used for prototyping, production, and repair of printed circuit boards (PCBs).
Q: What areas of PCB fabrication does Laser Direct Imaging PCB specialize in?
A: Laser Direct Imaging PCB specializes in imaging, drilling, and routing of printed circuit boards (PCBs).

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