Big size large size LCD repair refurbish bonding machine equipment

Bondingmachinefor LCD Refurbishment

FOG/FOB bonding machines.

bonding equipment.

bonding machine.

FOB bonding machine.

bonder machine.

bonder equipment.

1. About the application field of FOG/FOB bonding equipment XCM71 - A5

FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as. television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises.

2.About the basic parameters of FOG/FOB bonding equipment XCM71 -A5

Input Power. AC220V 50-60Hz

Working pressure .0.4-0 .8 Mpa

Operating modes. 7-inch HMI

Dimensions. L2210 × W1730 × H1500 mm

The method of Heating. heating or pulse heating thermostat

The quantity of Fixture. 2 group X-Y- micrometer adjustable

Range of Temperature . RT-500

Control program. PLC controller

Body main material. Steel + baking varnish

The thermocouple. K type

3.About the functions and characteristics of the FOG/FOB bonding equipment XCM71 - A5

3.1use pneumatic components of Japan SMC and high-precision the moving parts

3.2 use temperature controller of Japan and The function module of the integral PID self-tuning temperature,accurate temperature.

3.3 Imported PLC control.the operation of 7-inch full-color touch-screen

3.4SUNSOM the elimination structure of double-cylinder deadweight, accurate pressure.