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SMT SPI Solder Paste Inspection Machine For Inspecting PCB Anytime Report

Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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Address: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103

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Shenzhen SMTfly Electronic Equipment Manufactory Ltd

SMT SPI Solder Paste Inspection Machine For Inspecting PCB Anytime Report

Country/Region china
City & Province shenzhen chongqing
Categories Electronics Production Machinery
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Product Details

 

SMT SPI Used for Inspecting PCB with Solder Paste Inspection Machine,SMTfly-V850 Features:

 

High-precision control platform

 

The motion platform adopts servo motor and high-precision ball screw structure, and the motion is high-speed, smooth, vibration-free and noise-free.

High-precision grating scale with full closed loop feedback system.

 

High-definition, high-speed camera

 

Ultra-high frame rate industrial cameras with industrial lenses for extremely high shooting speeds; self-developed

RGB three-color light source, can realize 3D, 2D true color map, display effect is extremely close to real object;

Utilizing GPU massively parallel technology greatly improves the speed of operation and detection.

 

Ultra High Frame Rate Industrial Camera with Industrial Lens

 

Comprehensive and detailed SPC analysis system

 

SPC is the use of statistical methods for the process of the various stages of process control, through the analysis of test information feedback, to promote the improvement of the process before the process, in order to achieve the prevention of bad.

The operator can intuitively view the comprehensive statistics of test information through a pie chart or a bar chart.

Statistical information can be output in formats such as Html, Excel, or Image.

 

True color three-dimensional image

 

Phase Modulation Profilometry (PMP) is based on sinusoidal motion projection of structured gratings.

Discrete phase shift to obtain multiple illuminated object light field images, and then calculated according to multi-step phase shift method.

Out of the phase distribution, the final use of triangulation and other methods to obtain a high-precision object shape.

Contour and volume measurements. True color three-dimensional image display.

 

Red glue detection

 

This device, in addition to supporting common 3D solder paste inspection, can also detect red rubber process at the same time, supporting missed printing, overflowing plastics, multiple adhesives, and low adhesives, etc., and displaying full-color defective image. Positioning.

 

Bare-board learning programming

 

No Gerber and CAD files are required, as long as a bare board is provided, automatic learning programming can be realized. The software automatically extracts the detection frame data, and the user edits it appropriately, and sets detection parameters and allowable values.

 

Automatic plate bend compensation

 

The three-dimensional plate bending compensation technique is used to perform surface fitting on the discrete reference points in the FOV to perform real-time compensation during the detection process. There is no need to move the Z axis and the detection speed is faster.

 

Camera barcode recognition

 

The camera can automatically identify the bar code (one-dimensional/two-dimensional) of the inspection surface on the PCB to facilitate traceability of product quality.

 

              

 

Offline programming and debugging

 

The remote programming can be done by using offline programming software to import Gerger, CAD, etc. The programming time does not exceed 5 minutes.

 

SMT SPI Used for Inspecting PCB with Solder Paste Inspection Machine,SMTfly-V850 Specification:

 

CategoryItemSpecifications
Mechanical SystemPCB Transfer SystemSubstrate fixing method: bottom-up fixing; automatic access plate and automatic width adjustment system, conforming to SMEMA standard; track height: 900±20mm
 PCB size50mm*50mm ~ 330mm*250mm (can be customized according to customer specific requirements larger size) Another 460mmX510mm size optional
 PCB thickness0.3mm~4.5mm
 Plate bending compensation<2mm
 X, Y PlatformDrive Equipment

 

AC Servo Motor System

  Positioning accuracy<1μm
  Travel speed700mm/s
Control SystemComputer HostIndustrial Control Computer: Intel High-end quad-core CPU, 8GDDR memory, 1T hard disk
 Display output19-inch widescreen LCD monitor
Other parametersMechanical dimensions (length * width * height)100cm*100cm*155cm (high with feet without signal)
 Weight710 kg
 PowerAC220V±10%, 50/60Hz, 1200W
 Air source4-6bar
 Working environment Temperature10-40°C, Humidity 30-80%RH

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