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Immersion Silver Pcb Fabrication And Assembly Impedance Control

ShenZhen Jieteng Circuit Co., Ltd.

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Address: Building 1, Huafeng Science and Technology Park, No. 54 Guangtian Road, Luotian County community, Songgang Town, Bao'an District, Shenzhen City

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Immersion Silver Pcb Fabrication And Assembly Impedance Control

Country/Region china
City & Province shenzhen
Categories Solar Chargers
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Product Details

Product Description:

Multi-Layer PCB Fabrication is a process of producing multi-layer printed circuit boards with multiple layers ranging from 2 to 20. It offers a variety of surface finishes such as HASL, ENIG, OSP, and Immersion Silver, Immersion Tin, etc., for your multi-layer PCB needs. The technology also enables impedance control and the smallest line width and hole size of 0.1mm and 0.2mm respectively. In addition, the latest technology allows for the accurate assembly of Multi-Layer PCB components, offering unprecedented accuracy in Multi-Layer Printed Circuit Board production. Whether it is a high-density PCB or a low-volume PCB, Multi-Layer PCB Fabrication provides a reliable and cost-effective solution for all your multi-layer PCB requirements.

 

Features:

  • Multi-Layer PCB Manufacturing:
    • Solder Mask Color: Green, Blue, White, Black, Red, Etc.
    • Min. Line Spacing: 0.1mm
    • Layer Count: 2-20
    • Copper Thickness: 1-4oz
    • Min. Line Width: 0.1mm
  • Multi-Level Printed Wiring Board Creation:
    • Solder Mask Color: Green, Blue, White, Black, Red, Etc.
    • Min. Line Spacing: 0.1mm
    • Layer Count: 2-20
    • Copper Thickness: 1-4oz
    • Min. Line Width: 0.1mm
  • Multi-Layer PCB Component Assembly:
    • Solder Mask Color: Green, Blue, White, Black, Red, Etc.
    • Min. Line Spacing: 0.1mm
    • Layer Count: 2-20
    • Copper Thickness: 1-4oz
    • Min. Line Width: 0.1mm
 

Technical Parameters:

FeaturesSpecifications
Impedance ControlYes
Silkscreen ColorWhite, Black, Yellow, Etc.
Board Thickness0.2-3.2mm
Layer Count2-20
MaterialFR4, High TG FR4, Halogen Free, Rogers, Etc.
Min. Line Width0.1mm
Solder Mask ColorGreen, Blue, White, Black, Red, Etc.
Min. Hole Size0.2mm
Copper Thickness1-4oz
Surface FinishHASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Multi-Layer PCB ProductionYes
Multi-Layer PCB Component AssemblyYes
Multi-Level Printed Wiring Board CreationYes
 

Applications:

JTETENG's Multi-Layer PCB Fabrication is the perfect solution for anyone looking to create a multi-level printed wiring board. With a range of features, you can trust our product to help you create a reliable and durable printed circuit board. Our Multi-Layer PCB Fabrication offers a range of solder mask colors, including green, blue, white, black, and red, to ensure a perfect end result. We also offer a wide variety of board thicknesses, ranging from 0.2-3.2mm, and a minimum hole size of 0.2mm, so you know your board will be reliable and secure. Our Multi-Layer PCB Fabrication also offers a range of materials, including FR4, High TG FR4, Halogen Free, and Rogers, to ensure you get the perfect board for your needs. Additionally, our Multi-Layer PCB Fabrication offers a minimum line width of 0.1mm, so you can be sure that your board will be precise and accurate. With our Multi-Layer PCB Fabrication, you can trust that your multi-layer printed circuit board production and multi-level printed wiring board creation will be of the highest quality.

 

Customization:

JTETENG Multi-Layer PCB Manufacturing Services
Brand Name: JTETENG
Model Number: PCB circuit board
Place of Origin: China
Min. Line Width: 0.1mm
Impedance Control: Yes
Min. Hole Size: 0.2mm
Min. Line Spacing: 0.1mm
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
JTETENG provides high-quality Multi-Level Printed Circuit Board Fabrication services, which can meet your specific requirements for custom Multi-Layer PCB Manufacturing. We specialize in Multi-Level Printed Circuit Board Fabrication, including 0.1mm Min. Line Width, 0.2mm Min. Hole Size and 0.1mm Min. Line Spacing. Our PCB Circuit Boards are available with a range of Surface Finish options, such as HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.

 

Support and Services:

Multilayer PCB Fabrication Technical Support and Services

We provide comprehensive technical support and services for our Multilayer PCB Fabrication products. Our team of experienced engineers and technicians are here to assist with any and all of your Multilayer PCB fabrication needs.

  • Design and layout services for complex multilayer PCBs
  • Consultation and assistance with material selection
  • Customization of existing designs
  • Troubleshooting and repair of existing designs
  • Manufacturing and testing advice
  • Testing and qualification of new designs
  • On-site installation and training

Our experienced technical team is available to answer any questions or concerns you may have. We strive to provide the highest quality products and services to ensure your complete satisfaction.

 

Packing and Shipping:

Packaging and Shipping

Multilayer PCB Fabrication is shipped securely and safely, while minimizing any potential damage due to transit. The packaging and shipping of Multilayer PCB Fabrication is designed to provide the highest level of protection possible, with special attention paid to the delicate components.
The products are packaged in foam-lined corrugated cardboard boxes to ensure that they are well-protected during transit. The boxes are then sealed with the use of strong adhesive tape. The product is then shipped using a reliable and secure courier service, ensuring that it is delivered safely and in a timely manner.

 

FAQ:

Q: What is Multilayer PCB Fabrication?

A: Multilayer PCB Fabrication refers to the production of multilayer printed circuit boards (PCBs) using the JTETENG brand. The model number is PCB circuit board and the place of origin is China.

Q: What are the features of Multilayer PCB Fabrication?

A: Multilayer PCB Fabrication is a high-quality product with features such as excellent electrical performance, superior heat dissipation, high reliability, and a wide range of applications.

Q: What is the production process of Multilayer PCB Fabrication?

A: The production process of Multilayer PCB Fabrication includes material processing, circuit board layout, drilling, plating, etching, surface treatment, testing, and other processes.

Q: What are the types of Multilayer PCB Fabrication?

A: Multilayer PCB Fabrication are divided into two main types: rigid boards and flex boards. Rigid boards are suitable for prototypes or mass production of printed circuit boards with high reliability. Flex boards are suitable for printed circuit boards with a small number of layers and high flexibility.

Q: What materials are used for Multilayer PCB Fabrication?

A: Multilayer PCB Fabrication uses a variety of materials, including copper foil, epoxy resin, glass cloth, and other materials. Different materials are used depending on the application and requirements of the printed circuit board.











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