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[China]
Trade Verify
Address: Building 1, Huafeng Science and Technology Park, No. 54 Guangtian Road, Luotian County community, Songgang Town, Bao'an District, Shenzhen City
Contact name:Sales Manager
ShenZhen Jieteng Circuit Co., Ltd. |
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Verified Suppliers
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Multilayer PCB Fabrication is a production process of fabricating multi-layer printed circuit boards (PCBs). It involves the assembly of multi-layer components on a substrate material, such as FR4, high TG FR4, halogen free, rogers, etc. The production process is capable of producing min. line width of 0.1mm and min. line spacing of 0.1mm, with impedance control. Furthermore, the board thickness can be tailored from 0.2-3.2mm. The production process is suitable for high-complexity PCB designs, and is capable of providing high-precision and reliable multi-layer PCBs.
| Parameter | Description |
|---|---|
| Material | FR4, High TG FR4, Halogen Free, Rogers, Etc. |
| Layer Count | 2-20 |
| Min. Line Spacing | 0.1mm |
| Board Thickness | 0.2-3.2mm |
| Min. Line Width | 0.1mm |
| Impedance Control | Yes |
| Copper Thickness | 1-4oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc. |
| Silkscreen Color | White, Black, Yellow, Etc. |
| Solder Mask Color | Green, Blue, White, Black, Red, Etc. |
| Multi-Level Printed Wiring Board Creation | Yes |
| Multi-Layer PCB Component Assembly | Yes |
The JIETENG multi-layer PCB fabrication offers a variety of
components and materials that make it suitable for a wide range of
applications. With a brand name of JIETENG, the PCB circuit board
provides solder mask colors including green, blue, white, black,
and red. The copper thickness is available from 1-4oz, and the
material options include FR4, high TG FR4, Halogen-free, Rogers,
and more. The board thickness range is from 0.2-3.2mm, and layer
count can be 2-20. Customers can have the option to choose from
various components and materials to satisfy their needs.
JIETENG's multi-layer PCB fabrication is suitable for a wide range
of applications. It is used for multi-level printed wiring board
creation, multi-layer PCB component assembly, and multi-layer PCB
component assembly. The PCB circuit board can also be used for
automotive, medical, industrial control, and consumer electronics.
It has excellent thermal, electrical, and mechanical properties,
which make it an ideal choice for many applications.
The multi-layer PCB fabrication from JIETENG is a reliable and
cost-effective solution for customers. With its wide range of
components and materials, it is a perfect choice for various
applications. The high level of quality assurance ensures that the
PCB circuit boards are manufactured with precision and accuracy.
The multi-layer PCB fabrication will provide customers with a
reliable and cost-effective solution that is suitable for their
needs.
JIETENG is a leading provider of multi-layer printed circuit board
fabrication services. With years of experience and expertise in
this field, we are able to provide our customers with high quality
and reliable products.
Our multi-level printed wiring board creation services include:
We have a highly experienced and skilled team that is dedicated to
creating high quality multi-level printed wiring boards for our
customers. Our team is also able to provide custom solutions to
meet your specific needs.
At JIETENG, we strive to provide our customers with the highest
quality multi-level printed circuit board fabrication services.
Contact us today to find out more about our services.
Multilayer PCB fabrication is a complex process and requires a
great deal of expertise and experience. Our team of professional
engineers and technicians has extensive experience in providing
reliable, high-quality multilayer PCB fabrication services.
We offer a range of services to help ensure the success of your
project, including:
Our team is dedicated to providing the best possible service to ensure the highest quality outcome for your project. We strive to keep up with the latest advancements in technology to ensure our services are always up to date and efficient. We are committed to providing the best customer service and support to ensure your project is successful.
Multilayer PCB Fabrication is a delicate and complex process that requires careful packaging and shipping. To ensure that the product arrives in good condition, certain precautions should be taken when packaging and shipping.
The components and materials used in the Multilayer PCB Fabrication process must be properly secured and packaged in order to prevent damage during transit. All components should be wrapped in antistatic bags, and each component should be packed separately. All components should then be placed in a single box or container. The box or container should be securely sealed and labeled with the product name, destination, and other relevant information.
The box or container should then be shipped using a reliable carrier with tracking capabilities. Special care should be taken to ensure that the product is not exposed to extreme temperatures or moisture during transit. Additionally, the box should be clearly labeled with the product name, destination, and other relevant shipping information.
