Layer | 1~30 Layers |
Material | FR4, CEM1, CEM3, Hight TG, Rogers, F4B, Taconic, FR1, FR2, 94V0,
Aluminum |
Production Capacity | 30000 ㎡/months |
Board shape | Rectangular, Round, Slots, Cutouts, Complex Irregular |
Board cutting | Shear, V-Score, Tab-Routed, Counter Sunk |
Board thickness | 0.2~8.0mm, Flex 0.1-0.25mm |
Copper weight | 0.5oZ~12oZ |
Solder Mask | Double-sided Green LPI, Red, White, Yellow, Blue, Black, Purple
etc.Solder mask |
Silk screen | Double-Sided or Single-Sided in White, Yellow, Black etc |
Min line width/space | 0.08mm/3mil |
Max board dimensions | 25.6inch*43.3inch or 650mm*1100mm |
Min drill hole diameter | 0.1mm |
Min Laser Drill hole diameter | 0.075mm |
Surface finish | HASL, ENIG, Immersion Tin, Immersion Silver, OSP,ENEPIG etc |
Board thickness toleranc | ± 10% |