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According To Jedec Shape Standard Custom IC Chip Tray Less Than 0.76mm

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According To Jedec Shape Standard Custom IC Chip Tray Less Than 0.76mm

Country/Region china
City & Province shenzhen guangdong
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Product Details

According To Jedec Shape Standard Custom Jedec IC Tray

 

In the microelectronic industry, the standards have been established for the handling, loading, transportation and storage of IC,modules and other electronic components.These are usually referred to as Jedec standard matrix trays. It is suitable for all kinds of packages, including BGA,CSP,QFN,QFP,ect.

 

Details Of HN21127 Jedec Tray

 

The main material of HN21127 JEDEC tray is ABS,which is a kind of material with good anti-static, high temperature resistance and strong consolidation. The products made of this material are durable and do not pollute the environment. Our products have passed ROHS international environmental protection standards, customers do not have to worry about the environmental pollution after waste.

 

At the same time, the 8*8 matrix design can also maximize the loading of your products.The middle position of the tray slot will be designed to the adsorption area, which is convenient for automatic equipment to pick up the loaded products.The design of 45 degrees is also easier to be identified and positioned by the equipment, so as to achieve automatic use effect and reduce the cost.

Outline Line Size322.6*135.9*9.5mmBrandHiner-pack
ModelHN21127Package TypeDevices
Cavity Size14.08*8.3*3.62Matrix QTY8*8=64PCS
MaterialMPPOFlatnessMAX 0.76mm
ColorBlackPlace of originCHINA
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS SGS

 

Application of HN211127 Matrix Tray

 

Electronic Component Factory                     SMT Surfacing Factory

Optical Industry                                             Military Industry

MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

 

Advantages

 

1. Suitable for components or devices daily turnover or long-distance freight.

2. Can be stacked more layers.

3. Can be washed at high temperature.

4. Plastic waterproof, moisture-proof, improve the storage time of components.

5. No extrusion and breakage, Better protection components.

6. Reusable, quality assurance.

FAQ

 

Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.

Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8 days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

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