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Black ESD 2 Inch Waffle Pack For IC Parts 0.2mm Flatness ROHS

Shenzhen Hiner Technology Co.,LTD

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Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

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Black ESD 2 Inch Waffle Pack For IC Parts 0.2mm Flatness ROHS

Country/Region china
City & Province shenzhen guangdong
Categories Paper Bags
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Product Details

Black ESD 2 Inch Waffle Pack For IC Parts 0.2mm Flatness

The Waffle pack is a bare chip carrier used for transporting and handling small batches of Mrico chips. It is usually a plastic tray whose pockets are sized to fit a particular chip.

 

The Waffle pack is almost the pocketed tray and usually made of plastic.When packing, factories typically use pickup and placement equipment for loading so that each pocket contains a IC "on the inside". After loading,the IC parts are covered with anti-static tyvek paper and lids. Finally, use matching clips to hold the waffle packages together.

 

Details about the HN21102 Black ESD 2 Inch Waffle Pack

 

This HN21102 waffle pack has distinct advantages over regular tape reel, Especially for very small parts. It allows automatic loading of electronic parts 5.3*5.3mm and can provide safe and assured professional packaging for the parts provided by customers.

 

At the same time,It is made of a good conductive material which can effectively release the charge on the surface of the product.This greatly reduces the rate of damage during production, and the use of waffle packaging can both reduce the cost and improve the quality of the product.

Outline Line Size50.8*50.8*4mmBrandHiner-pack
ModelHN21102Package TypeDie
Cavity Size5.31*5.31*0.41Matrix QTY7*7=49PCS
MaterialABS.PCFlatnessMAX 0.2mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS SGS

 

Product Application Of Waffle Pack Chip Tray

 

Electronic component           Embedded System

Test and Measurement         Technology Power supply

 

Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMTBCCustomizable
Provide professional design and packaging for your products

 

Advantages Of IC Tray

 

1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers.
3. Can be washed at specified temperature.
4. Plastic waterproof, moisture-proof, improve the storage time of components.
5. No extrusion and breakage, Better protection components.
6. Reusable, quality assurance.

 

FAQ Of Bare Die Tray

 

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please

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