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Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case

Shenzhen Hiner Technology Co.,LTD

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Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

Contact name:Rainbow Zhu

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Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case

Country/Region china
City & Province shenzhen guangdong
Categories Other Eyewear
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Product Details

Black ABS Waffle Pack Chip Tray for Optical Device

 

The Waffle Pack is widely used in semiconductor, photoelectric industry. The product requires a high degree of cleanliness and size. From the design drawings, mold manufacturing, product manufacturing to cleaning packing , all of the steps and operations through strict quality control. To deliver the ultimate goal of customer satisfaction for product, our company continuously meet the customer's requirements and promote our factory to a higher level of progress.

 

 1.Details about The HN21093 Black ABS Waffle Pack Chip Tray for Optical Device

 

The HN21093 Waffle Pack is a tray made of industrial plastics. The raw material can be recycled, and it is easy to be degraded after waste. There is no concern about environmental protection. It is small in size, light in weight and low in transportation cost.

At the same time, the 20*20 matrix can hold a large number of products, which is suitable for transfer or loading sample testing. The Hiner-pack also produces covers and clamps ,which are suitable for fastening and transporting all kinds of waffle packs.

 

Outline Line Size50.7*50.7*4mmBrandHiner-pack
ModelHN21093Package TypeBare Die
Cavity Size0.95*1.25*0.46Matrix QTY20*20=400PCS
MaterialABSFlatnessMAX 0.2mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS SGS

 

2.Product Application

 

Optical device packaging                             Electrical equipment and systems
Electronic component packaging                 Wafer Die / Bare / Chips

 

Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMTBCCustomizable
Provide professional design and packaging for your products

 

3.Advantages

 

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production.

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years experience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

4.FAQ

 

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

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