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ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips

Shenzhen Hiner Technology Co.,LTD

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Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

Contact name:Rainbow Zhu

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ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips

Country/Region china
City & Province shenzhen guangdong
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Product Details

ABS Black 4 Inch Waffle Pack for Micro IC Chips

 

The ABS Waffle Pack is an ideal tray for storing tiny ic chip, which has permanent anti-static performance. In the process of using, it has good mechanical strength and heat resistance. Meanwhile, the product has good impact strength and chemical corrosion resistance, and will not be affected by the environment, time and temperature to change its ESD performance.

 

1.Details about the HN21097 ABS Black 4 Inch Waffle Pack for Micro IC Chips

 

Because the IC chip is prone to friction during storage and transportation, the quality of the product may be affected or even damaged if the ESD property is not available. Customers can use the HN21097 Waffle pack made of ABS to store electronic components or ic chips, which can effectively avoid short circuit.

 

The waffle pack can effectively release the static charge accumulated on the surface of the object, so that it will not produce large charge and high potential difference. Therefore, it can lower the damage rate of the product in the production process and transportation, reducing the cost of the product and improve the quality and profit.

Outline Line Size101.6*101.6*9mmBrandHiner-pack
ModelHN21097Package TypeDie
Cavity Size4.35*5.45*2.5Matrix QTY10*14=140PCS
MaterialABSFlatnessMAX 0.3mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS SGS

 

2.Our Service

 

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

 

MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

 

3.Advantages

 

1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers.
3. Can be washed at high temperature.
4. Plastic waterproof, moisture-proof, improve the storage time of components.
5. No extrusion and breakage, Better protection components.
6. Reusable, quality assurance.

4.FAQ

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

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