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ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

Shenzhen Hiner Technology Co.,LTD

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Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

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ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

Country/Region china
City & Province shenzhen guangdong
Categories Packaging Paper
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Product Details

ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

 

Antistatic Matrix Chip Tray For Moisture Protection In Normal Environment

 

IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).

 
Antistatic plastic tray can eliminate static electricity, a large number of electronic devices and products in the production process of turnover loading, packaging, storage and transportation. The finished product has good mechanical strength and heat resistance; Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time and temperature. It is mainly used in the electronic product industry.

 

Advantages

 

1. More than 10 years export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. Factory has ISO certification, and the products comply to RoHS standard.

7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service        or cost performance has been well recognized

 

Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMTBCCustomizable
Provide professional design and packaging for your products

 

 

Outline Line Size50*50*4mmBrandHiner-pack
ModelHN 210*210-24Package TypeIC Parts
Cavity Size5.33*5.33*6.1mmMatrix QTY7*7=49PCS
MaterialABSFlatnessMAX 0.2mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS

 

Material Description

 

ESD Conductive Material

Also can be antistatic or Conductive and can be normal one .

 

Application

 

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

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