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[China]
Trade Verify
Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Contact name:Rainbow Zhu
Shenzhen Hiner Technology Co.,LTD |
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Verified Suppliers
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Customized Waffle Micro Electronic Component Tray Structurally Standard
Structurally Standard ESD PC Waffle Pack With Different
Requirements Can Be Customized For Micro Electronic Component
Waffle pack has many applications including the packaging of die,
die attach preforms and bond pads. Waffle pack is becoming a much
more desirable form of packaging as component sizes continue to
shrink.
Waffle pack has distinct advantages over taping, particularly with
parts that are very small. Waffle packing permits the automated
loading of parts as small as .0005.
As the tray in the field of optical application, more and more
customers in order to protect components or optical devices, are
willing to choose injection molding tray for packaging solution,
because the tray can carrier component also provides comprehensive
protection to transit and transport provides great convenience, all
kinds of specifications and various color can be realized,Provide
one-stop service from design to production to packaging.
Silicon dies can be delivered in a tray which is also known as
waffle pack – a plastic tray with pockets that match the die size.
A waffle pack has a lid and is delivered in an antistatic bag.
Waffle packs are ideal for delivering small number of silicon dies,
typically from a MPW process.
Product Application
Wafer Die / Bar / Chips
PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
| Cavity Size | Customized Size |
| Item Material: | ABS / PC / MPPO / PPE... acceptable |
| OEM & ODM: | YES |
| Item Color: | Can be customized |
| Feature: | Durable;Reusable;Rcofriendly;Biodegradable |
| Sample: | A. The free samples: choosen from existing products. |
| B. customized samples as per your design/demand | |
| MOQ: | 500pcs. |
| Packing: | Carton or as per customer's request |
| Delivery time: | Usually 8-10 working days,depends on order quantity |
| Term of payment: | Products:100% prepayment. Mold:50% T/T deposit, 50% balance after sample confirmation |
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design
capabilities, in the mass production of all kinds of IC trays also
have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY
of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged
according to different product value.and all samples shipping cost
normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP
etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to
customer order qty and volume.
