Home Companies Shenzhen Hiner Technology Co.,LTD

Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static

Shenzhen Hiner Technology Co.,LTD

Contact Us

[China] country

Trade Verify

Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

Contact name:Rainbow Zhu

Inquir Now

Shenzhen Hiner Technology Co.,LTD

Verified Suppliers
  • Trust
    Seal
  • Verified
    Supplier
  • Credit
    Check
  • Capability
    Assessment

Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static

Country/Region china
City & Province shenzhen guangdong
InquireNow

Product Details

Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static

 

Customized high temperature resistant Waffle Pack for carrying tiny modules

 

Hiner-pack production IC tray is in line with international environmental standards,through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions

 

Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.
 

Benefits

 

Able to present non-standard components to Pick and Place machines

Multiple uses for fixture including component bake-out, storage and shipping

Cost effective alternative to “tape and reel” or “hand” placement

 

1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, no environmental concerns
7. It can be stack-able and can also ensure the design of maximum utilization of tray matrix

 

Product Application

 

Wafer Die / Bar / Chips                     PCBA module component

Electronic component packaging      Optical device packaging

 


Packaging


Packaging Details:Packing according to customer's specified size

Outline Line Size1101.51*101.51*6.2mm
ModelHN21016
Cavity Size6.62*8.29*0.8mm
MaterialPC
ColorBlack
Resistance1.0x10e4-1.0x10e11Ω
BrandHiner-pack
Package TypeIC Parts
Matrix QTY9*7=63PCS
FlatnessMAX 0.3mm
ServiceAccept OEM,ODM
CertificateROHS
 Customized Size
Item MaterialABS / PC / MPPO / PPE... acceptable
OEM&ODMYES
Item ColorCan be customized
FeatureDurable;Reusable;Rcofriendly;Biodegradable
SampleA. The free samples: choosen from existing products.
B. customized samples as per your design/demand
MOQ500pcs.
PackingCarton or as per customer's request
Delivery timeUsually 8-10 working days,depends on order quantity
Term of paymentProducts:100% prepayment.
Mold:50% T/T deposit, 50% balance after sample confirmation

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Hot Products

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type High Quality Jedec IC Tray ...
ROHS Black ESD Jedec Tray High Temperature Resistant For LGA IC Chips High temperature resistant and ...
Custom Black Jedec Tray Anti Static Components Matrix Trays High temperature resistant and ...
Custom Static Black Matrix Jedec IC Trays MPPO For Semiconductor Custom Static Jedec IC Trays Matrix ...
JEDEC Outline BGA Matrix Tray With Standard Pocket Design Electrostatic discharge (ESD) even a small ...
Hiner-Pack Standard Colorfully Jedec IC Tray For Hold Micro IC Components The standard that Jedec ...