|
[China]
Trade Verify
Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Contact name:Rainbow Zhu
Shenzhen Hiner Technology Co.,LTD |
|
Verified Suppliers
|
|
|
Providing a variety of packaging IC design solutions based on
your chip, the 100% custom tray is not only suitable for storing IC
but also better protect the chip storage.We have designed a lot of
packaging way, which also contains common BGA, FBGA, LGAQFN,
QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom
service for all packaging methods of chip tray .
Hiner offer the ultimate protection and convenience. We offer a
wide variety of JEDEC outline matrix trays to satisfy the most
demanding requirements of today's automatic test and handling
environments. While JEDEC standards provide compatibility with
process equipment, every device and component has its own
requirements for tray pocket details .
Our Advantages
1. Flexible OEM service: we can produce products according to
customer’s sample or design.
2. Various Materials: the material can be
MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection
molding,Production
4. Comprehensive customer service: from customer consultation to
after sales service.
5. 10 years’ex perience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level
and produce products quickly and flexibly.
Product Application
Electronic component Semiconductor
Embedded System Display technology
Micro and Nano systems Sensor
Test and Measurement
Techology
Electromechanical equipment and systems Power supply
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN 2074 | Package Type | BGA IC |
| Cavity Size | 10.8*5.3*1.1mm | Matrix QTY | 22*9=198PCS |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost
effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply
with the international JEDEC standards, to ensure 100% qualified
rate.
