Home Companies Shenzhen Hiner Technology Co.,LTD

Recycled ESD Custom Jedec Trays Transport BGA Chips High Temperature

Shenzhen Hiner Technology Co.,LTD

Contact Us

[China] country

Trade Verify

Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

Contact name:Rainbow Zhu

Inquir Now

Shenzhen Hiner Technology Co.,LTD

Verified Suppliers
  • Trust
    Seal
  • Verified
    Supplier
  • Credit
    Check
  • Capability
    Assessment

Recycled ESD Custom Jedec Trays Transport BGA Chips High Temperature

Country/Region china
City & Province shenzhen guangdong
Categories Cushion Cover
InquireNow

Product Details

Recycled ESD Custom Jedec Trays Transport BGA Chips High Temperature
 
Customize JEDEC Standard High Temperature Black IC Tray For BGA Chips
 

Character Reference

 

Material: PPE

Thickness: 7.62,12.19mm

Appearance: black

Customized: width and length, thickness as customer request

Conductive: 10e4-10e6 ohms

Anti-static: 1.0*10e4-1.0*10e11 ohms

 

The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carriing components or IC of the tray, carriing function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, improve work efficiency.

 

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.

 

Benefits

 

Able to present non-standard components to Pick and Place machines

Multiple uses for fixture including component bake-out, storage and shipping

Cost effective alternative to “tape and reel” or “hand” placement

 

Application:

 

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

 

ModelHN1839Package TypeBGA IC
Cavity Size12*12*1.8mmSizeCustomized
MaterialPPEFlatnessMAX 0.76mm
Resistance1.0x10e4-1.0x10e11ΩServiceAccept OEM,ODM
ColorGreen &BlackCertificateROHS
UsagePackaging of Electronic Components,Optical device,
FeatureESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
MaterialMPPO.PPE.ABS.PEI.IDP...etc
ColorBlack.Red.Yellow.Green.White and custom color
SizeCustomized size, rectangle,circle shape
Mold typeInjection Mold
DesignOriginal sample or we can create the designs
PackingBy Carton
SampleSample time: after draft confirmed and payment arranged
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated
Lead Time5-7 Working days
The exact time should according to the ordered quantity

FAQ

 

Q1. Do your products get any certificates?
Yes, CE for EU market, FDA for USA market.

Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into perfect fact. It does not matter if you do not have some one to complete files. Send us high resolution images, your logo and text and tell us how you would like to arrange them. We will send you finished files for confirmation.

Q3. How long is the delivery time?
For standard machine, it would be 5-7Working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.

Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L and other certificates as required by clients.

Hot Products

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type High Quality Jedec IC Tray ...
ROHS Black ESD Jedec Tray High Temperature Resistant For LGA IC Chips High temperature resistant and ...
Custom Black Jedec Tray Anti Static Components Matrix Trays High temperature resistant and ...
Custom Static Black Matrix Jedec IC Trays MPPO For Semiconductor Custom Static Jedec IC Trays Matrix ...
JEDEC Outline BGA Matrix Tray With Standard Pocket Design Electrostatic discharge (ESD) even a small ...
Hiner-Pack Standard Colorfully Jedec IC Tray For Hold Micro IC Components The standard that Jedec ...