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Anti Static Custom Jedec Trays For LGA Package

Shenzhen Hiner Technology Co.,LTD

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Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

Contact name:Rainbow Zhu

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Anti Static Custom Jedec Trays For LGA Package

Country/Region china
City & Province shenzhen guangdong
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Product Details

Anti Static Custom Jedec Trays For LGA Package
 
Durable Anti-Static Black Tray For Different LGA Package Chip Sizes

 

 

Hiner-pack providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.

 

Benefits

 

1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, no environmental concerns
7. It can be stack-able and can also ensure the design of maximum utilization of tray matrix

 

Product Advantage

 

1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japen...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

 

 

Product Application

 

Electronic component       Semiconductor       Embedded System   Display technology

Micro and Nano systems  Sensor                   Test and Measurement Techology
Electromechanical equipment and systems    Power supply


Reference to temperature resistance of different materials

Outline Line Size322.6*135.9*10.3mmBrandHiner-pack
ModelHN20100Package TypeLGA IC
Cavity Size35.65*45.75*5.2mmMatrix QTY6*3=18PCS
MaterialPPEFlatnessMAX 0.76mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS
UsagePackaging of Electronic Components,Optical device,
FeatureESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
MaterialMPPO.PPE.ABS.PEI.IDP...etc
ColorBlack.Red.Yellow.Green.White and custom color
SizeCustomized size, rectangle,circle shape
Mold typeInjection Mold
DesignOriginal sample or we can create the designs
PackingBy Carton
SampleSample time: after draft confirmed and payment arranged
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated
Lead Time5-7 Working days
The exact time should according to the ordered quantity

FAQ

 

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize

the project depending on the specific time

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