Electronic Components IC Tray Injection Moulding For Wafer Bare

Electronic Components IC Tray Injection Moulding For Wafer Bare

Various Kinds Of Electronic Components Trays Customized Samples

For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products,In order to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions.

Our company has skillful and well-trained team in the field of Semiconductor packaging design to work out customer's requirements,for instance,different temperature,color,ESD property and cleanliness class etc.Experienced product structure engineering team can design various of IC chip,wafer,precision components packaging methods and specifications and other special demands to fit you well.

Application

Semiconductor Wafer Die Wafter Bare, Electronic components, optical electronic components, etc

Character Reference

Industrial Use:Electronic
Feature:Recyclable
Custom Order:Accept
Place of Origin:Shenzhen, China (Mainland)
Brand Name:Hiner-pack
Model Number:HN1808
Surface resistance:10e4-10e11 ohms
Color:Black
Property:Antistatic/ESD
Thickess:7.62mm
CAD drawing:available
Customized:width, length, thickness as customer request
Offer Designing:Yes