Molding Power Choke SMD Inductors Chip Integrated Circuit Inductor
High Current alloy powder
SMD Power Inductor Original Smd Alloy Powder Molded Chip Integrated
Circuit Ic 1.0uH~4.7uH
Molding Power Choke SMD Inductors Chip Integrated Circuit Inductor
High Current Alloy Powder
Features:
- Magnetically shielded construction, low DC resistance;
- The use of magnetic iron powder ensure capability for large
current;
- Low audible core noise;
- Ideal for DC-DC converter applications in hand held personal
computer and etc;
- Handles high transient current spikes without saturation
- Ultra low buzz noise, due to composite construction
- Ultra-thin size, can be applied to MINI products
- Small tolerance, no heat generation, convenient production
Applications:
- Smart phone,MID;
- Next-generation mobile devices with multifunction such as adding
color TV and digital movie cameras;
- Flat-screen TVs, blue-ray disc recorders, set top box;
- Notebooks, desktop computers, servers, graphic cards;
- Portable gaming devices, personal navigation systems, personal
multimedia devices;
- Automotive systems;
- Bluetooth Products
Specification:
tem | Description |
Category | Molding Power Inductor |
Inductance | 0.10uH~10uH |
Current Rating (Amps) | 40A~6.0A |
Size / Dimension | 7.1*6.6*2.4mm |
Material | alloy powder |
![](http://img.everychina.com/nimg/33/9f/df80aee750b73f4ebc58b7126da3.jpg)
![](http://img.everychina.com/nimg/84/90/12f13ece93633f3e3165a90afca2.jpg)
Dimensions
![](http://img.everychina.com/nimg/93/7b/157ec64bd263edf46a6bda7a0f3b.jpg)
Specification
![](http://img.everychina.com/nimg/06/36/f25e7ddd1f2e342a4fe79ed8ecc0.jpg)
Packaging Information:
NOTES:
- DC current (Idc) that will cause an approximate △T of 40℃
- DC current (Isat) that will cause Lo to drop approximately 20%
- All test data is referenced to 25℃ ambient
- Operating Temperature Range -55℃ to +120℃
- The part temperature (ambient + temp rise) should not exceed 120℃
under the worst operating conditions.
- Circuit design, component placement, PWB trace size and thickness,
airflow and other cooling provisions
- all affect the part temperature. Part temperature should be
verified in the end application.
Packaging Quantity(pcs)
![](http://img.everychina.com/nimg/66/c8/ae2ea8313be02603253d72767437.jpg)