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Co-Polyamide Hot Melt PA Adhesive Tape High Temperature Double Sided for SIM Cards

Shenzhen Tunsing Plastic Products Co., Ltd.

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Address: Tunsing Industrial Zone, No. 28 Xiatian village, Longtian street, Pingshan District, Shenzhen City, Guangdong Province, China

Contact name:Abby Zou

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Co-Polyamide Hot Melt PA Adhesive Tape High Temperature Double Sided for SIM Cards

Country/Region china
City & Province shenzhen guangdong
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Product Details

Co-Polyamide Hot Melt PA Adhesive Tape High Temperature Double Sided for SIM Cards

Hot Melt Adhesive Tape Product: DS-4

 

Hot Melt Adhesive Tape Description:

The hot melt adhesive is used for embedding of contact smart cards. Excellent adhesion to PVC, FR-4 and other materials.This product belongs to hot-melt tape with low and medium temperature properties. Very strong cohesion and good flexibility to ensure that no structural fracture will occur in the thrust and bending tests after bonding, while maintaining a balanced bond strength with the chip and the card base, and has excellent punchability. Meet the requirements of ISO7816 standard for chip package fastness.

 

Hot Melt Adhesive Tape Composition:

Copolyamide

 

Hot Melt Adhesive Tape Application Field:

DS-4 is suitable for heat embedding of IC cards, SIM cards, financial social security cards, and contact bank cards.

 

Hot Melt Adhesive Tape Physical Characteristics:

ColorLight YellowRelease ProtectionGlassine Release Paper
Proportion1.08±0.02g/cm³Conventional Thickness0.055mm±0.008mm
Melting Range70-95℃ (Tunsing DSC 214)Conventional Width29.2mm
Melt Flow Index75±25g/10min(ASTM D1238-04)Conventional Length200m
HardnessD 58±2 (Shore )Finished Product0.055mm*29.2mm*200m

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