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FR4 PI 1-20 Layers FPC Rigid Flex PCB Circuit Board

Guangzhou Highleap Electronic  Co.,Ltd.  
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Address: Room 1306, building 2, No. 96, Lixin 12 road, Xintang Town, Zengcheng District, Guangzhou

Contact name:Howard

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Guangzhou Highleap Electronic Co.,Ltd.  

FR4 PI 1-20 Layers FPC Rigid Flex PCB Circuit Board

Country/Region china
City & Province guangzhou
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Product Details

1-20 Layers FPC /flex/rigid/rigid flex pcb circuit board manufacturer 

PROCESS
Item
Unit
Limit Tolerance
Normal tolerance
Board cutting & thickness
 
Layer
/
1-6 layer
1-6 layer
/
2-layer(rigid flex)
2-layer(rigid flex)
cutting size: 250mm
mm
250*1000mm
250*500mm
 
Min. thickness
mm
0.075mm(FPC)
0.10mm(FPC)
mm
0.3mm(rigid flex)
0.3mm(rigid flex)
Other auxiliary material
Adhesive stiffener
um
PSA:50um
PSA:50um
hot setting adhesive
um
12.5/25/40um
12.5/25/40um
PI stiffener
um
PI: 1.0-13mil
PI: 1.0-13mil
Other stiffener type
/
steel, Al, silicon steel sheet
 
 
Drilling
Min. drilling hole size
mm
0.1
0.2
hole diameter tolerance
mm
±0.075
±0.1
PTH
hole wall copper thickness
um
8/15/25
8/15/25
Exposure
Min line width/space
mm
0.05/0.05
0.075/0.075
hole ring
mm
0.125
0.2
offset tolerance
mm
0.1
0.15
Line width tolerance
mm
±0.03
±0.04
Distance between hole edge to outline
mm
≥0.4
≥0.5
Lamination
Coverlay tolerance
mm
0.15
0.2
PI stiffener with outline
mm
±0.3
±0.3
Sensitive PSA
mm
±0.3
±0.3
FR4 location tolerance
mm
±0.3
±0.3
Ink
Soler mask thickness
um
8
15
Silk screen thickness
um
8
15
Profile
R angle for etching cutting die
mm
0.5
0.5
 
mm
LS: ±0.075
LS: ±0.075
 
Steel die tol.
mm
HS: ±0.01
HS: ±0.01
 
mm
Etching: ± 0.20
Etching: ± 0.30
 
Cutting die tol.
mm
Wooden: ± 0.30
Wooden: ± 0.50
Laser tol.
mm
± 0.05
± 0.05
Offset tol. for fingers
mm
± 0.10
± 0.10
Surface treatment
 
um
Ni: 2.0~5.0
Ni: 2.0~5.0
 
Immersion gold
um
Au: 0.03~0.08
Au: 0.03~0.08
Plating tin
um
8~20
8~20
About HighLeap Electronic
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FAQ

Q1.What file you need to prepare if you want to get an quotation from us?
For PCB board, you need to prepare files of Gerber file,it should including RS-274X,ODB++, DXF, PCB, PCBDOC etc formats.
For PCBA(PCB with soldered components), except the file for PCB, you also need to prepare the BOM list (components list), Pick and Place file(txt format), real sample pictureor 3D PDF version file etc.

 

Q2. Do you have any MOQ Limited ?
We havent any limited about MOQ .Sample and mass production all can support.

 

Q3. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

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