Silicon Wafer Cutter High-speed High Precision Laser Cutting
Machine for Sapphire Cutting
Model introduction:
Sapphire is the most hard material after the diamond, sapphire easy
to break and collapse, and it’s quite difficult for this material
in the elaborate processing. Herolaser specialized in the
development of micro processing technology for many years, which
has accumulated rich experience on sapphire cutting
punch.Sub-nanosecond long pulse sapphire laser precision cutting
machine,is developed of aiming at the need of sapphire material
industry application. This equipment has the advantages of high
cutting speed, high precision, no need to replace the consumables,
complete functions, simple operation, continuous work under the
conditions of various performance indicators are stable and
reliable.This equipment has tested in Sapphire cutting punch
field,and achieved enough affirmation and agreement from consumers.
Model features:
- The appearance of integrated design with our patent, compact and
reliable structure; full closed constant temperature design, using
the optical marble platform, high stability.
- No need to adjust the light path,it can be external trigger and
easy to integrate.
- Non-contact processing,cutting edge smooth without collapse,high
yield.
- Optional servo motor or linear motor, high precision CCD automatic
positioning, full closed-loop feedback, high precision, fast speed,
processing speed 10 times than traditional tools.
- It can be equipped with all kinds of fixtures and dust extraction
device for hard and brittle materials.
Advantages of New Technology:
1. No micro-cracks, broken or debris after processing ;
2. Super highly crack resistance of edge and maintaining optical
performance after processing;
3. No consumable parts, no washing, grinding and polishing after
cutting ,highly reduced production costs;
4. Suitable for thinner and lighter materials ,also good for
irregular holes processing ;
5. Higher speed and accuracy than traditional processing, best
choice for mass production.
Comparison table with other processing methods:
| 1mm Sapphire Cutting | Picosecond laser | CNC machine | Fiber laser cutting |
Φ10mm hole | 180 pieces / hour 20 s / piece | 100 pieces / hour 36 s / piece | 720 pieces / hour 5 s / piece |
| Processing Efficiency | Low | Lower | High |
| Operational Difficulty | Very Hard | Hard | Easy |
Investment | Higher | Low | High |
Consumable parts | Yes | Yes | No |
Applied range:
Mainly used in electronics industry of sapphire windows materials,
all kinds of hard and brittle materials of precision cutting and
punching;also can be used in thin walled high-reflective metal
cutting and non-metal material marking, etching processing, such as
hardware, ceramics, electronic devices, all kinds of instruments
and plastic, etc.
Samples for reference:
FAQ
1. How is the payment?
- 30% deposit before production and the balance 70% before shipment
2. How is the delivery and shipment?
- Ship in 7 days after 100% payment;
- Plywood box packaging
3. How will you guarantee aftersales services?
- We offer two warranty for laser source, one year for whole machine
and lifetime maintenance services.
- Engineers available to service machinery overseas
- Free technical training in our factory
- Free sample can be sent to you
- Professional technical team 24 hours online
4. How about your presales service?
- Speeding offer within 8 hours quick response and free consulting.
- Free sample cutting or testing is available
- Progressing solution design to all clients, including distributors
and end users.
