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SMT / DIP Customized PCBA , PCB Assemblies With X-Ray AOI Testing For BGA

Shenzhen Xinchenger Electronic Co.,Ltd
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Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China

Contact name:karen

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Shenzhen Xinchenger Electronic Co.,Ltd

SMT / DIP Customized PCBA , PCB Assemblies With X-Ray AOI Testing For BGA

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

SMT / DIP Customized PCBA Assembly With X-Ray Testing For BGA 

 

 

Specification:

 

PCBA QCX-Ray,AOI test
ServicePCB,PCBA
Surface finishingHASL,Lead free
Material rawFR4
Cu thickness1OZ
ProcessingSMT
Line space8mil
Line width8mil

 

 

Parameter

 

1

Layer

2 layer

2

Material

FR-4 lead free

3

Board thickness

1.2mm

4

Finished board side

40*20mm

5

Min.drilled hole size

0.25mm

6

Min.line width

0.25mm

7

Min.line spaceing

0.25mm

8

Surface finish/treatment

HALS/HALS lead free

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

Standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,CQC

15

Profiling Punching

Routing,V-CUT,Beveling

16

Assembly Service

Providing OEM service to all sorts of printed circuit board assembly

 

 

Quick detail:

 

  • Model:XCEA
  • Solder mask:Green,white silk screen 
  • Size:10*5cm
  • Location:Shenzhen
  • Application:
  • Industrial control
  • Alarm products
  • Measurement device
  • Telecom audio and video
  • Electronic security health and medical
  • LED application test instrument
  • Consumer electronics

 

Advantage:

 

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

 

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