Green FR4 BGA Multilayer HASL-LF PCB ISO 9001 1.6mm Electronic PCB Board

FR4 BGA Multilayer HASL-LF PCB ISO9001 1.6mm Electronic Board

Thickness

specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:HASL-LF

Quick detail:
Origin:China
Special: FR4 Material
Layer:10
Thickness:1.6mm
Surface: HASL-LF
Hole:0.5

Specification:
FR4 BGA Multilayer HASL-LF PCB ISO9001 1.6mm Electronic Board
Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
with electronic level glass fiber cloth as reinforcing material of substrate.
Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
in production of multilayer printed circuit board,
This kind of product is mainly used for double-sided PCB, dosage is very large.
Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
in recent years because of the electronic product installation technology
and PCB technology development needs, appeared high Tg FR - 4 products.

You need an authentic specialist of rigid PCB maker!
ShenZhen Xinchenger Electronics Co.,Ltd to be your rigid PCB manufacturer, including multilayer PCB design, fabrication and PCB assembly(PCBA). Our responsive team will offer you rigid PCB manufacturing and assembly services with a range of process control, refined and strict PCB work-flow and quality commitment.

Who We Are
As a service-leading custom PCB board manufacturing and PCB assembly (PCBA) partner, ShenZhen Xinchenger Electronics Co.,Ltd to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our headquarter is located in Shenzhen, China. We have 10,000 square meters plant, 287 employees and 42 engineers, monthly capabilities of 15,000 square meters PCB design & fabrication and 80 million spot SMT. We were approved by ISO9001-2008, TS16949, UL, CE, RoHS.

Specification:

FR4 BGA Multilayer HASL-LF PCB ISO9001 1.6mm Electronic Board

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.

Immersion Gold and the difference between gold-plated plate 1, immersion gold and gold-plated crystal structure is not the same as the thickness of gold for gold than gold-plated lot of gold will be gold-plated gold is more yellow, more satisfied customers. 2, immersion gold and gold-plated crystal structure is not the same, Shen Jin is easier than gold-plated welding, will not cause poor welding, causing customer complaints. Immersion gold plate of the stress more easily controlled, there is a bonding of products, more conducive to the processing of bonding. But also because of the gold than the gold-plated soft, so Shen Jin-board do not wear gold finger. 3, immersion gold plate only nickel gold pads, skin effect of the signal transmission is in the copper layer will not affect the signal. 4, immersion gold than gold-plated crystal structure is more compact, not easy to produce oxidation. 5, with the wiring more and more dense, line width, spacing has come to 3-4MIL. Gold is easy to produce gold short-circuit. Immersion gold plate only nickel gold on the pad, it will not produce gold short-circuit. 6, immersion gold plate only nickel gold on the pad, so the resistance of the line with the combination of copper layer is more solid. Engineering will not compensate for the spacing of the impact. 7, generally used for the relatively high requirements of the board, flatness is better, generally use immersion gold, immersion gold generally do not appear after the assembly of the black pad phenomenon. Immersion gold plate flatness and standby life as good as gold-plated plate

Parameter:

What we need:

* Gerber files of the bare PCB
* Bill of materials to include: Manufacturer's part number, type of part, type of packaging,
component locations listed by reference designators and quantity
* Dimensional specifications for non-standard components
* Assembly drawing, including any change notices
* Final test procedures (if available)