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Mobile Phone printed circuit board assemblies With Min Line , Width 0.13mm

Shenzhen Xinchenger Electronic Co.,Ltd
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Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China

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Shenzhen Xinchenger Electronic Co.,Ltd

Mobile Phone printed circuit board assemblies With Min Line , Width 0.13mm

Country/Region china
City & Province shenzhen guangdong
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Product Details

Mobile Phone printed circuit board assemblies With Min Line , Width 0.13mm
 
 
Advantage
 
Multilayer rogers pcb printed circuit board
 
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
 
Multilayer pcb circuit boards :4Layer -36 layer
 
 
We can supply:
 
Rogers High Frequency Laminate/Material
High frequency pcb manufacture
PCB assembly
 
Parameter:

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling

 
 
Description :
The standard FR-4 material that is used in our PCBExpress® Quickturn, ValueProto® and the default material for our PCBpro® Full Feature products is a high temperature, high Td, low CTE 150Tg material.
If a higher Tg material is required, we do stock a 170Tg version of our standard FR-4 material as well, that can be substituted in our PCBpro Full Feature and Custom Quote products (provide a readme file or a print note specifying the 170 Tg material). There may be a material lead time for some specific sizes or thickness, and may impact due date.
FR-4 (or FR4) is a grade designation assigned to glass-reinforced epoxy laminate sheets, tubes, rods and printed circuit boards (PCB). FR-4 is a composite material composed of woven fiberglass cloth with anepoxy resin binder that is flame resistant (self-extinguishing).
 
PrePreg Material
It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

 

Liquid photo solder resist (commonly known as green oil) is a protective layer coated on the printed circuit board without welding line and the substrate, or as a solder resist. Aim is long-term protection circuit patterns formed.
Liquid photoimageable solder resist ink main ingredients include: epoxy and acrylic resins having a photosensitive properties, such as Bisphenol epoxy resin, phenol resin, phenol epoxy resin and amine methyl and ethyl; photoinitiator such as thioxanthone, benzophenone, carbonyl compounds, ketones investigation, amine organic metal compound; fillers such as silica powder; hardeners, such as an aromatic ester, acid anhydride, imidazole sigh class; solvent, such as ether esters class; defoamers and the like. The coating method is generally used serigraphy, and similar wet film.
Its role is as follows:
(1) preventing the physical disconnection of the conductor circuit;
(2) welding process, to prevent a short circuit due to bridging generated;
(3) must be welded only in part for welding, solder avoid waste;
(4) reduction of copper welding tank pollution;
(5) to prevent dust, moisture and other environmental factors cause insulation deterioration, corrosion;
(6) having a high insulation resistance, high-density circuit becomes possible.
 
 
Rogers material in stock:

 

BrandModelThickness(mm)DK(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO40030.254 0.508,0.813,1.5243.38
RO43500.254 0.508,0.762,1.5243.5
RO58800.254.0.508.0.7622.2
RO30030.127,0.508,0.762,1.5243
RO30100.63510.2
RO32060.635MM10.2
R030350.508MM3.5
RO60100.635MM, 1,27MM10.2

 

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