Active Member
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[China]
Address: 1706-067, Floor 17, Guangyin Bldg., No. 38, Futian South Road, Kou'an Community, Futian Street, Futian Dist. Shenzhen
Contact name:Eliane Lee
Shenzhen Fany Technology Co.,Ltd |
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High TG170 FR4 Multilayer HDI PCB with Buried and Blind Via Holes
1. Product Descprition
| Item | Specification |
| Material | High TG FR4 |
| Layers | 4-20 layers |
| HDI | HDI plus 1 or 2 |
| Copper thickness | 1/3-12OZ |
| Minimum Via | 0.1mm |
| Surface treatment | ENIG,OSP |
| Board thickness | 0.15-4.5mm |
| Solder mask color | Gree,Blue,Black,Red,White |
| Tolerance of board thickness | T>=1.0mm, Tol: +/-10% T<1.0mm, Tol:+/-0.1mm |
2.HDI capablity and example
1) X+X process
( Layer Drawing) (Cross section)
2) 1-N-1 process
( Layer Drawing) (Cross section)
3)2-N-2 process-B
( Layer Drawing) (Cross section)
4)2-N-2 process-N(Advanced:6+N+6)
( Layer Drawing) (Cross section)
3. Application
1)Communication electronic equipment:Smartphone,Multifunctional Phone,visual telephone
2)Computer:Laptop, Super computer, Pad.
3) Consumer Electronics: Camera, Digital TV, Video
4) Car
5) Equipments
6) Space and aviation: satellite,guided missile
7) Medical Appliances
8) Industral Control
4.Package
